BE768887A - PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE - Google Patents

PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE

Info

Publication number
BE768887A
BE768887A BE768887A BE768887A BE768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A
Authority
BE
Belgium
Prior art keywords
panels
manufacture
printed circuit
procede
ledit
Prior art date
Application number
BE768887A
Other languages
French (fr)
Inventor
H L Rhodenizer
J J Grunwald
W P Innes
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Priority to BE768887A priority Critical patent/BE768887A/en
Priority to DE2135384A priority patent/DE2135384C3/en
Publication of BE768887A publication Critical patent/BE768887A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
BE768887A 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE BE768887A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
BE768887A BE768887A (en) 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE
DE2135384A DE2135384C3 (en) 1971-06-23 1971-07-12 Process for the manufacture of printed circuit boards and the product manufactured by this process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE768887A BE768887A (en) 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE
DE2135384A DE2135384C3 (en) 1971-06-23 1971-07-12 Process for the manufacture of printed circuit boards and the product manufactured by this process

Publications (1)

Publication Number Publication Date
BE768887A true BE768887A (en) 1971-11-03

Family

ID=25656911

Family Applications (1)

Application Number Title Priority Date Filing Date
BE768887A BE768887A (en) 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE

Country Status (2)

Country Link
BE (1) BE768887A (en)
DE (1) DE2135384C3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000294A1 (en) * 1978-07-13 1980-02-21 Tokyo Shibaura Electric Co Method of fabricating printed circuits
DE3576900D1 (en) * 1985-12-30 1990-05-03 Ibm Deutschland METHOD FOR PRODUCING PRINTED CIRCUITS.
WO2018198981A1 (en) 2017-04-27 2018-11-01 Agc株式会社 Antenna and mimo antenna

Also Published As

Publication number Publication date
DE2135384A1 (en) 1973-02-01
DE2135384B2 (en) 1979-12-13
DE2135384C3 (en) 1980-08-21

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