BE768887A - PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE - Google Patents
PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDEInfo
- Publication number
- BE768887A BE768887A BE768887A BE768887A BE768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A
- Authority
- BE
- Belgium
- Prior art keywords
- panels
- manufacture
- printed circuit
- procede
- ledit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE768887A BE768887A (en) | 1971-06-23 | 1971-06-23 | PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE |
DE2135384A DE2135384C3 (en) | 1971-06-23 | 1971-07-12 | Process for the manufacture of printed circuit boards and the product manufactured by this process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE768887A BE768887A (en) | 1971-06-23 | 1971-06-23 | PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE |
DE2135384A DE2135384C3 (en) | 1971-06-23 | 1971-07-12 | Process for the manufacture of printed circuit boards and the product manufactured by this process |
Publications (1)
Publication Number | Publication Date |
---|---|
BE768887A true BE768887A (en) | 1971-11-03 |
Family
ID=25656911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE768887A BE768887A (en) | 1971-06-23 | 1971-06-23 | PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE |
Country Status (2)
Country | Link |
---|---|
BE (1) | BE768887A (en) |
DE (1) | DE2135384C3 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1980000294A1 (en) * | 1978-07-13 | 1980-02-21 | Tokyo Shibaura Electric Co | Method of fabricating printed circuits |
DE3576900D1 (en) * | 1985-12-30 | 1990-05-03 | Ibm Deutschland | METHOD FOR PRODUCING PRINTED CIRCUITS. |
WO2018198981A1 (en) | 2017-04-27 | 2018-11-01 | Agc株式会社 | Antenna and mimo antenna |
-
1971
- 1971-06-23 BE BE768887A patent/BE768887A/en unknown
- 1971-07-12 DE DE2135384A patent/DE2135384C3/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2135384A1 (en) | 1973-02-01 |
DE2135384B2 (en) | 1979-12-13 |
DE2135384C3 (en) | 1980-08-21 |
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