GB2040101A - Method of fabricating printed ciurcuits - Google Patents
Method of fabricating printed ciurcuitsInfo
- Publication number
- GB2040101A GB2040101A GB8007439A GB8007439A GB2040101A GB 2040101 A GB2040101 A GB 2040101A GB 8007439 A GB8007439 A GB 8007439A GB 8007439 A GB8007439 A GB 8007439A GB 2040101 A GB2040101 A GB 2040101A
- Authority
- GB
- United Kingdom
- Prior art keywords
- adhesive layer
- ciurcuits
- fabricating printed
- roughened surface
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
- H05K2203/097—Corona discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Abstract
Printed circuits are fabricated by first providing an insulated substrate (12) having an adhesive layer (11) mainly composed of diene synthetic rubber with a roughened surface. The roughened surface (11a) of the adhesive layer (11) is then subjected to a corona discharge treatment, being followed by forming conductive patterns (14, 23) onto the surface of the adhesive layer (11) by chemical plating, thereby forming a printed circuit.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8459478A JPS5512716A (en) | 1978-07-13 | 1978-07-13 | Method of forming printed circuit |
JP9317278A JPS605237B2 (en) | 1978-08-01 | 1978-08-01 | How to form printed circuits |
JP9317378A JPS5521105A (en) | 1978-08-01 | 1978-08-01 | Method of forming printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2040101A true GB2040101A (en) | 1980-08-20 |
GB2040101B GB2040101B (en) | 1982-09-15 |
Family
ID=27304600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8007439A Expired GB2040101B (en) | 1978-07-13 | 1979-06-30 | Method of fabricating printed ciurcuits |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2952961C1 (en) |
GB (1) | GB2040101B (en) |
WO (1) | WO1980000294A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0135674A2 (en) * | 1983-06-10 | 1985-04-03 | Matsushita Electric Works, Ltd. | Production of metal surface-laminated sheet |
GB2172436A (en) * | 1985-03-16 | 1986-09-17 | Marconi Electronic Devices | Printed circuits |
EP0195612A2 (en) * | 1985-03-16 | 1986-09-24 | Marconi Electronic Devices Limited | Printed circuit arrangement |
EP0195611A2 (en) * | 1985-03-16 | 1986-09-24 | Marconi Electronic Devices Limited | Printed electrical circuit and method of connecting components therewith |
EP0225985A1 (en) * | 1985-10-21 | 1987-06-24 | International Business Machines Corporation | Method of making a printed circuit board |
EP0273376A1 (en) * | 1986-12-30 | 1988-07-06 | E.I. Du Pont De Nemours And Company | Embedded catalyst receptors for metallization of dielectrics |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6993540B2 (en) * | 2019-12-17 | 2022-01-13 | 日本発條株式会社 | Semi-finished products for laminates, bonding methods and circuit boards |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1006692B (en) * | 1953-10-29 | 1957-04-18 | Siemens Ag | Process for the production of firmly adhering metal coverings on all kinds of documents |
BE768887A (en) * | 1971-06-23 | 1971-11-03 | Macdermid Inc | PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE |
DE2136212B1 (en) * | 1971-07-20 | 1972-05-31 | Aeg Isolier Und Kunststoff Gmbh | Process for the production of a base material for printed circuits |
JPS5423342B2 (en) * | 1972-03-02 | 1979-08-13 | ||
JPS5123266B2 (en) * | 1972-04-21 | 1976-07-15 | ||
JPS5517507B2 (en) * | 1972-06-29 | 1980-05-12 | ||
US3978252A (en) * | 1973-03-23 | 1976-08-31 | Macdermid Incorporated | Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon |
JPS5133862A (en) * | 1974-09-18 | 1976-03-23 | Matsushita Electric Works Ltd | Purintohaisenkiban no seiho |
JPS51119969A (en) * | 1975-04-14 | 1976-10-20 | Fujikura Ltd | Method of manufacturing printed wiring substrate |
DE2624709A1 (en) * | 1976-06-02 | 1977-12-15 | Licentia Gmbh | Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage |
-
1979
- 1979-06-30 WO PCT/JP1979/000171 patent/WO1980000294A1/en unknown
- 1979-06-30 GB GB8007439A patent/GB2040101B/en not_active Expired
- 1979-06-30 DE DE2952961A patent/DE2952961C1/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0135674A2 (en) * | 1983-06-10 | 1985-04-03 | Matsushita Electric Works, Ltd. | Production of metal surface-laminated sheet |
EP0135674A3 (en) * | 1983-06-10 | 1987-05-06 | Matsushita Electric Works, Ltd. | Production of metal surface-laminated sheet |
GB2172436A (en) * | 1985-03-16 | 1986-09-17 | Marconi Electronic Devices | Printed circuits |
EP0195612A2 (en) * | 1985-03-16 | 1986-09-24 | Marconi Electronic Devices Limited | Printed circuit arrangement |
EP0195611A2 (en) * | 1985-03-16 | 1986-09-24 | Marconi Electronic Devices Limited | Printed electrical circuit and method of connecting components therewith |
EP0199450A2 (en) * | 1985-03-16 | 1986-10-29 | Marconi Electronic Devices Limited | Printed electrical circuit |
EP0199450A3 (en) * | 1985-03-16 | 1987-09-02 | Marconi Electronic Devices Limited | Printed electrical circuit |
EP0195612A3 (en) * | 1985-03-16 | 1987-09-16 | Marconi Electronic Devices Limited | Printed circuit arrangement |
EP0195611A3 (en) * | 1985-03-16 | 1987-09-16 | Marconi Electronic Devices Limited | Printed electrical circuit and method of connecting components therewith |
GB2172436B (en) * | 1985-03-16 | 1989-06-21 | Marconi Electronic Devices | Electrical circuit |
EP0225985A1 (en) * | 1985-10-21 | 1987-06-24 | International Business Machines Corporation | Method of making a printed circuit board |
EP0273376A1 (en) * | 1986-12-30 | 1988-07-06 | E.I. Du Pont De Nemours And Company | Embedded catalyst receptors for metallization of dielectrics |
Also Published As
Publication number | Publication date |
---|---|
GB2040101B (en) | 1982-09-15 |
DE2952961C1 (en) | 1983-03-31 |
WO1980000294A1 (en) | 1980-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |