DE2624709A1 - Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage - Google Patents

Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage

Info

Publication number
DE2624709A1
DE2624709A1 DE19762624709 DE2624709A DE2624709A1 DE 2624709 A1 DE2624709 A1 DE 2624709A1 DE 19762624709 DE19762624709 DE 19762624709 DE 2624709 A DE2624709 A DE 2624709A DE 2624709 A1 DE2624709 A1 DE 2624709A1
Authority
DE
Germany
Prior art keywords
adhesion promoter
aminoplast
modified rubber
base material
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762624709
Other languages
German (de)
Inventor
Manfred Dr Phil Saure
Johann Dipl Chem Wartusch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19762624709 priority Critical patent/DE2624709A1/en
Publication of DE2624709A1 publication Critical patent/DE2624709A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

A base material for printed circuits has an adhesion promoter of an aminoplast-modified rubber. The base material is conventionally made of GRP etc. and laminated with the modified rubber. The aminoplast is pref. a melamine or urea resin, esp. a non-plasticised, n-butanol etherified highly reactive melamine resin. Both the surface as well as the materials's whole thickness provides active sites for subsequent metallisation so that surface treatment to roughen it is no longer necessary.

Description

Basismaterial für gedruckte Schaltungen Base material for printed circuits

Die vorliegende Erfindung bezieht sich auf ein Basismaterial für gedruckte Schaltungen mit einem Haftvermittler aus einem harzmodifizierten Kautschuk.The present invention relates to a base material for printed matter Circuits with an adhesion promoter made from a resin-modified rubber.

Es ist bereits bekannt, zu metallisierende Kunststoffoberflächen bzw. die Oberflächen eines Basismaterials, das zur Herstellung von gedruckten Schaltungen dienen soll, zwecks Aufrauhung chemisch, insbesondere durch eine Oberflächenbeizung mit Oxidationsmitteln enthaltender Schwefelsäure oder Borflußsäure vorzubehandeln, um eine ausreichende Haftung der rletallisierlmg zu gewährleisten.It is already known to metallize plastic surfaces or the surfaces of a base material used in the manufacture of printed circuits is to serve, for the purpose of roughening chemically, in particular by surface pickling to be pretreated with oxidizing agents containing sulfuric acid or hydrofluoric acid, to ensure adequate adhesion of the metallic coating.

So ist es bekannt, als Haftvermittler ein#phenolharzmodifizierten Kautschuk für diesen Zweck zu verwenden.It is known to use a phenolic resin modified as adhesion promoter To use rubber for this purpose.

Es ist auch schon bekannt, duroplastische Formmassen auf Phenol- oder Nelamin/Phenolharzbasis zu galvanisieren. Aber auch diese Massen erfordern einen chemischen Aufschluß mittels oxidierenden Medien, z.B. Chromschwefelsäure.It is already known to use thermoset molding compounds on phenol or Electroplating nelamine / phenolic resin base. But these masses also require one chemical digestion using oxidizing media, e.g. chromosulfuric acid.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Basismaterial herzustellen, bei dem sowohl die Oberfläche als auch die gesamte Schichtdicke in einfacher Weise mit Aktivstellen für die Metallisierung versehen werden kann, so daß eine oxidative, chemische Oberflachenbellandlung zwecks Aufrauhung der Oberfläche entfallen kann.The present invention is based on the object of a base material manufacture where both the surface as well as the whole Provide layer thickness in a simple manner with active sites for the metallization can be, so that an oxidative, chemical surface treatment for the purpose of roughening the surface can be omitted.

Ferner ist zu fordern, daß die Aktivstellen möglichst gleichmäßig und in der angestrebten Dosierung über die Oberfläche und/oder das Volumen verteilt angeordnet sind.A further requirement is that the active points are as uniform as possible and distributed in the desired dosage over the surface and / or the volume are arranged.

Gelöst wird die Aufgabe dadurch, daß der IIaftvermittler aus harzmodifiziertem Kautschuk mit Zusätzen aus Polymeren auf Basis von Aminoplastharzen, insbesondere Melamin- oder Harnstoffharzen versehen wird.The object is achieved in that the IIaftvermittler made of resin-modified Rubber with additives made from polymers based on amino resins, in particular Melamine or urea resins are provided.

Offenbar sind die polaren bzw. polarisierbaren Gruppen in dem Aminoplastharz für den Sorptionsvorgang des Katalysators für die Metallisierung von Bedeutung.Apparently the polar or polarizable groups are in the aminoplast resin for the sorption process of the catalyst for the metallization of importance.

Zur Herstellung des Basismaterials werden z.B. zu verpressende Prepregs, hergestellt aus üblichen Glasgewebe- oder Papierlagen, die mit einem Gemisch aus einer rz-ärter-lösung und der Zusatzkomponente nach der Erfindung imprägniert sind, in bekannter Weise zu einem Schichtpreßstoff weiterverarbeitet.For the production of the base material, e.g. prepregs to be pressed, made from conventional fiberglass or paper layers with a mixture of a rz-arter solution and the additional component according to the invention are impregnated, further processed in a known manner to form a laminate.

In ähnlicher Weise kann eine Harz- und/oder Kautschuklösung, in der die Zusatzkomponenten nach der Erfindung gelöst sind, als haftvermittelnde Schicht auf das Basismaterial aufgebracht werden.Similarly, a resin and / or rubber solution in which the additional components according to the invention are dissolved, as an adhesion-promoting layer be applied to the base material.

Je nach Basismaterial oder Haftvermittlerschicht kann es zweckmäßig sein, daß vor dem Katalysieren und Metallisieren eine geeignete Vorbehandlung erfolgt, z.B. durch mechanische Aufrauhung, wie z.B. Naßbürsten. Eine chemische Vorbehandlung ist Jedoch nicht erforderlich.Depending on the base material or adhesion promoter layer, it can be useful ensure that a suitable pretreatment is carried out before catalyzing and metallizing, e.g. by mechanical roughening, e.g. wet brushing. A chemical pretreatment However, it is not required.

Je nach den zu stellenden Anforderungen kann der Anteil der Zusatzkomponente im Basismaterial und/oder in der Haftvermittlerschicht in weiten Grenzen variieren.Depending on the requirements to be made, the proportion of the additional component vary within wide limits in the base material and / or in the adhesion promoter layer.

Obgleich auch bei 130,oigem Anteil der Zusatzkomponente eine Wirksamkeit bei der Metallisierung besteht, hat es sich aus verschiedenen Gründen als zweckmäßig erwiesen, einen Anteil von 10 bis 30 %~, bezogen auf die Festsubstanz des Ilaftvermittlers, einzusetzen.Although it is also effective with 130% of the additional component exists in the metallization, it has proven to be useful for various reasons proven, a proportion of 10 to 30% ~, based on the solid substance of the Ilaftvermittler, to use.

Ausführungsbeispiel: 70 Gew. Tl. Nitrilkautschuk 25 ~ ~# Vulkanisier-Phenolharz 5 " II Vernetzungsbeschleuniger 30 " " Melaminharz Eine 30 /um dicke Schicht des Haftvermittlers wurde mit Hilfe einer Transferfolie auf einen Stapel aus mit vorreagiertem Epoxidharz/iIärter-Gemisch imprägniertem Glas gewebe in einer Presse während einer Stunde bei 170 0C gepreßt, so daß eine einheitliche Platine mit der gewünschten Oberflächenschicht; aus Haftvermittler entsteht. Die Haftvermittlerschicht kann auf der Transferfolie vor dem Verpressen während 15 min bei 1500C vorgehärtet aber auch nur getrocknet werden.Exemplary embodiment: 70 parts by weight of nitrile rubber 25 ~ ~ # vulcanizing phenolic resin 5 "II Crosslinking Accelerator 30" "Melamine Resin A 30 / µm thick layer of the Adhesion promoter was applied to a stack of pre-reacted with the help of a transfer film Epoxy resin / hardener mixture impregnated glass fabric in a press during a Pressed hour at 170 0C, so that a uniform board with the desired Surface layer; originates from adhesion promoter. The adhesion promoter layer can but pre-cured on the transfer film for 15 minutes at 1500C before pressing even just to be dried.

Nach einem leichten mechanischen Aufrauhen der Oberfläche der so hergestellten Platine, z.B. mittels einer Bürstanlage, werden nach an sich bekannter Katalysierung und stromloser Verkupferung Haftfestigkeiten bis zu 60 N/25mm erhalten.After a slight mechanical roughening of the surface of the so produced Blanks, e.g. by means of a brushing system, are catalysed in a known manner and electroless copper plating obtained adhesive strengths of up to 60 N / 25mm.

Als besonders geeignet hat sich für die Erfindung ein nicht plastifiziertes, n-butanolveräthertes, hochreaktives Nelaminharz erwiesen.A non-plasticized, Proven n-butanol etherified, highly reactive nelamine resin.

Je nach den zu stellenden Anforderungen kann anstelle eines Melaminharzes auch ein Aminoplastharz auf ifarnstoffbasis wirksam eingesetzt werden.Depending on the requirements, a melamine resin can be used instead an aminoplast resin based on urea can also be effectively used.

3 Seiten Beschreibung 4 Patentansprüche3 pages description 4 claims

Claims (4)

P a t e n t a n s p r ü c h e 1 Basismaterial für gedruckte Schaltungen mit einem Haftvermittler aus einem harzmodifizierten Kautschuk, dadurch gekennzeichnet, daß der Haftvermittler einen Zusatz eines Aminoplastharzes aufweist. P a t e n t a n s p r ü c h e 1 Base material for printed circuits with an adhesion promoter made of a resin-modified rubber, characterized in that that the adhesion promoter has an addition of an aminoplast resin. 2. Basismaterial nach Anspruch 1, dadurch gekennzeichnet, daß der Haftvermittler einen Zusatz eines Melaminharzes aufweist.2. Base material according to claim 1, characterized in that the Adhesion promoter has an addition of a melamine resin. 3. dasismaterial nach Anspruch 2, dadurch gekennzeichnet, daß die Zusatzkomponente ein butanolveräthertes Melaminharz aufweist.3. dasismaterial according to claim 2, characterized in that the Additional component has a melamine resin etherified with butanol. 4. Basismaterial nach Anspruch ~1, dadurch gekennzeichnet, daß der Haftvermittler einen Zusatz eines Harnstoffharzes aufweist.4. Base material according to claim ~ 1, characterized in that the Adhesion promoter has an addition of a urea resin.
DE19762624709 1976-06-02 1976-06-02 Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage Withdrawn DE2624709A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19762624709 DE2624709A1 (en) 1976-06-02 1976-06-02 Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624709 DE2624709A1 (en) 1976-06-02 1976-06-02 Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage

Publications (1)

Publication Number Publication Date
DE2624709A1 true DE2624709A1 (en) 1977-12-15

Family

ID=5979609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762624709 Withdrawn DE2624709A1 (en) 1976-06-02 1976-06-02 Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage

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DE (1) DE2624709A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2952961C1 (en) * 1978-07-13 1983-03-31 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Process for the production of a printed circuit
DE3241225A1 (en) * 1982-11-09 1984-05-10 F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach METHOD FOR THE PRODUCTION OF ELECTRONIC SWITCHING ELEMENTS AND / OR CIRCUITS IN MULTILAYER THICK FILM TECHNOLOGY (MULTILAYER THICK FILM TECHNOLOGY) ON A SUBSTRATE AND SWITCHING ELEMENTS MANUFACTURED AND ITS DESIGN

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2952961C1 (en) * 1978-07-13 1983-03-31 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Process for the production of a printed circuit
DE3241225A1 (en) * 1982-11-09 1984-05-10 F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach METHOD FOR THE PRODUCTION OF ELECTRONIC SWITCHING ELEMENTS AND / OR CIRCUITS IN MULTILAYER THICK FILM TECHNOLOGY (MULTILAYER THICK FILM TECHNOLOGY) ON A SUBSTRATE AND SWITCHING ELEMENTS MANUFACTURED AND ITS DESIGN

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