JPH0246331B2 - - Google Patents

Info

Publication number
JPH0246331B2
JPH0246331B2 JP60020973A JP2097385A JPH0246331B2 JP H0246331 B2 JPH0246331 B2 JP H0246331B2 JP 60020973 A JP60020973 A JP 60020973A JP 2097385 A JP2097385 A JP 2097385A JP H0246331 B2 JPH0246331 B2 JP H0246331B2
Authority
JP
Japan
Prior art keywords
chuck
annular
vacuum suction
semiconductor wafer
central
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60020973A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61182738A (ja
Inventor
Kazuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibayama Kikai Co Ltd
Original Assignee
Shibayama Kikai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibayama Kikai Co Ltd filed Critical Shibayama Kikai Co Ltd
Priority to JP2097385A priority Critical patent/JPS61182738A/ja
Publication of JPS61182738A publication Critical patent/JPS61182738A/ja
Publication of JPH0246331B2 publication Critical patent/JPH0246331B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Jigs For Machine Tools (AREA)
JP2097385A 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構 Granted JPS61182738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2097385A JPS61182738A (ja) 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2097385A JPS61182738A (ja) 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構

Publications (2)

Publication Number Publication Date
JPS61182738A JPS61182738A (ja) 1986-08-15
JPH0246331B2 true JPH0246331B2 (enrdf_load_stackoverflow) 1990-10-15

Family

ID=12042109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2097385A Granted JPS61182738A (ja) 1985-02-07 1985-02-07 ウエハのフリ−サイズチヤツク機構

Country Status (1)

Country Link
JP (1) JPS61182738A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332538A (ja) * 1989-06-28 1991-02-13 Disco Abrasive Syst Ltd ユニバーサルチャックテーブル
JPH0332537A (ja) * 1989-06-28 1991-02-13 Disco Abrasive Syst Ltd ユニバーサルチャックテーブル
JP2841851B2 (ja) * 1990-11-27 1998-12-24 日本電気株式会社 シリコン基板の研磨装置および研磨方法
JPH081464A (ja) * 1992-06-17 1996-01-09 Shibayama Kikai Kk ユニバーサルチャック機構の自動切換装置
JP2001024051A (ja) 1999-07-09 2001-01-26 Tokyo Seimitsu Co Ltd ウェーハ吸着パッド
JP2003059872A (ja) * 2001-08-17 2003-02-28 Disco Abrasive Syst Ltd 研削装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022500B2 (ja) * 1980-05-23 1985-06-03 株式会社デイスコ 位置合せ載置方法
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板
JPS5930631A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 吸着保持装置

Also Published As

Publication number Publication date
JPS61182738A (ja) 1986-08-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term