JPH0246054Y2 - - Google Patents

Info

Publication number
JPH0246054Y2
JPH0246054Y2 JP1981138160U JP13816081U JPH0246054Y2 JP H0246054 Y2 JPH0246054 Y2 JP H0246054Y2 JP 1981138160 U JP1981138160 U JP 1981138160U JP 13816081 U JP13816081 U JP 13816081U JP H0246054 Y2 JPH0246054 Y2 JP H0246054Y2
Authority
JP
Japan
Prior art keywords
die
semiconductor element
circuit board
bonding
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981138160U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5842940U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981138160U priority Critical patent/JPS5842940U/ja
Publication of JPS5842940U publication Critical patent/JPS5842940U/ja
Application granted granted Critical
Publication of JPH0246054Y2 publication Critical patent/JPH0246054Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W70/656—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/884—
    • H10W72/931—
    • H10W72/932—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1981138160U 1981-09-16 1981-09-16 混成集積回路装置 Granted JPS5842940U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981138160U JPS5842940U (ja) 1981-09-16 1981-09-16 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981138160U JPS5842940U (ja) 1981-09-16 1981-09-16 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS5842940U JPS5842940U (ja) 1983-03-23
JPH0246054Y2 true JPH0246054Y2 (cg-RX-API-DMAC10.html) 1990-12-05

Family

ID=29931394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981138160U Granted JPS5842940U (ja) 1981-09-16 1981-09-16 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS5842940U (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207655A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444773A (en) * 1977-09-16 1979-04-09 Nippon Cetu Kk Method of mounting electronic parts to printed board
JPS5797634A (en) * 1980-12-11 1982-06-17 Canon Inc Hybrid integrated circuit

Also Published As

Publication number Publication date
JPS5842940U (ja) 1983-03-23

Similar Documents

Publication Publication Date Title
US4774635A (en) Semiconductor package with high density I/O lead connection
US4903114A (en) Resin-molded semiconductor
JP3494901B2 (ja) 半導体集積回路装置
JP3138539B2 (ja) 半導体装置及びｃｏｂ基板
JPH0246054Y2 (cg-RX-API-DMAC10.html)
USRE36894E (en) Semiconductor package with high density I/O lead connection
JP2797598B2 (ja) 混成集積回路基板
JPH01258458A (ja) ウェーハ集積型集積回路
JPH06507276A (ja) リードフレームに接合された介在ダイ取付基板を有する集積回路パッケージ設計
JP2982182B2 (ja) 樹脂封止型半導体装置
JPH0484452A (ja) 樹脂封止型半導体装置
JPH023621Y2 (cg-RX-API-DMAC10.html)
JP2890621B2 (ja) 混成集積回路装置
JP2670392B2 (ja) 半導体集積回路装置
JPH0732216B2 (ja) 半導体装置
JP2587722Y2 (ja) 半導体装置
JP2552887Y2 (ja) 絶縁物被覆電子部品
JP2596606B2 (ja) 樹脂封止型半導体装置及びその製造方法
JP3393708B2 (ja) 半導体パッケージの製造方法
JPH02241040A (ja) 半導体装置の製造方法
JPH0720924Y2 (ja) 半導体装置
JP3275787B2 (ja) 樹脂封止型半導体装置およびその製造方法
JPS5844593Y2 (ja) ビ−ム・リ−ド型半導体装置
KR200169976Y1 (ko) 반도체 패키지
JP3130826B2 (ja) 半導体装置