JPH0245708B2 - - Google Patents

Info

Publication number
JPH0245708B2
JPH0245708B2 JP58016253A JP1625383A JPH0245708B2 JP H0245708 B2 JPH0245708 B2 JP H0245708B2 JP 58016253 A JP58016253 A JP 58016253A JP 1625383 A JP1625383 A JP 1625383A JP H0245708 B2 JPH0245708 B2 JP H0245708B2
Authority
JP
Japan
Prior art keywords
photoresist
precious metal
lead
plating
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58016253A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59143071A (ja
Inventor
Hide Myazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP1625383A priority Critical patent/JPS59143071A/ja
Publication of JPS59143071A publication Critical patent/JPS59143071A/ja
Publication of JPH0245708B2 publication Critical patent/JPH0245708B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • ing And Chemical Polishing (AREA)
JP1625383A 1983-02-04 1983-02-04 貴金属メツキ部を有する金属製品の製造法 Granted JPS59143071A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1625383A JPS59143071A (ja) 1983-02-04 1983-02-04 貴金属メツキ部を有する金属製品の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1625383A JPS59143071A (ja) 1983-02-04 1983-02-04 貴金属メツキ部を有する金属製品の製造法

Publications (2)

Publication Number Publication Date
JPS59143071A JPS59143071A (ja) 1984-08-16
JPH0245708B2 true JPH0245708B2 (enrdf_load_stackoverflow) 1990-10-11

Family

ID=11911394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1625383A Granted JPS59143071A (ja) 1983-02-04 1983-02-04 貴金属メツキ部を有する金属製品の製造法

Country Status (1)

Country Link
JP (1) JPS59143071A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5448653A (en) * 1977-09-27 1979-04-17 Toshiba Corp Etching of metal plate

Also Published As

Publication number Publication date
JPS59143071A (ja) 1984-08-16

Similar Documents

Publication Publication Date Title
US5683943A (en) Process for etching a semiconductor lead frame
JPS5826828B2 (ja) テ−プキヤリアの製造方法
US3074145A (en) Semiconductor devices and method of manufacture
US6008068A (en) Process for etching a semiconductor lead frame
US4139434A (en) Method of making circuitry with bump contacts
JPH10229153A (ja) リードフレームの製造方法
JPH0245708B2 (enrdf_load_stackoverflow)
US5403466A (en) Silver plating process for lead frames
JPH05283412A (ja) 半導体装置,およびその製造方法
JPH01147848A (ja) Ic用リードフレームの製造方法
JP3136194B2 (ja) リードフレームの製造方法
JP3076950B2 (ja) 半導体装置用リードフレームの製造方法
JP2637175B2 (ja) 半導体用多ピンリードフレームの製造方法
JPS604221A (ja) 半導体装置の製造方法
JPS60211862A (ja) 半導体装置用リ−ドフレ−ムの製造方法
JP2632464B2 (ja) リードフレームの製造方法
JP3674238B2 (ja) リードフレームの製造方法
JP2959144B2 (ja) リードフレームの製造方法
JPS6372889A (ja) リ−ドフレ−ムの製造方法
JPS622644A (ja) 支持体付きリ−ドフレ−ムの製造方法
JPS6022501B2 (ja) 半導体装置の製造方法
JPS612156A (ja) フオトフアブリケーシヨン用マスクの製作方法
JPH1041448A (ja) リードフレーム
JPS6218059A (ja) リ−ドフレ−ムの製造方法
JPH09181246A (ja) リードフレーム及びその製造方法