JPS59143071A - 貴金属メツキ部を有する金属製品の製造法 - Google Patents
貴金属メツキ部を有する金属製品の製造法Info
- Publication number
- JPS59143071A JPS59143071A JP1625383A JP1625383A JPS59143071A JP S59143071 A JPS59143071 A JP S59143071A JP 1625383 A JP1625383 A JP 1625383A JP 1625383 A JP1625383 A JP 1625383A JP S59143071 A JPS59143071 A JP S59143071A
- Authority
- JP
- Japan
- Prior art keywords
- exposed
- noble metal
- leads
- photoresist
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims abstract description 20
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 5
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 5
- 239000010970 precious metal Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000002659 electrodeposit Substances 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004544 spot-on Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1625383A JPS59143071A (ja) | 1983-02-04 | 1983-02-04 | 貴金属メツキ部を有する金属製品の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1625383A JPS59143071A (ja) | 1983-02-04 | 1983-02-04 | 貴金属メツキ部を有する金属製品の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143071A true JPS59143071A (ja) | 1984-08-16 |
| JPH0245708B2 JPH0245708B2 (enrdf_load_stackoverflow) | 1990-10-11 |
Family
ID=11911394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1625383A Granted JPS59143071A (ja) | 1983-02-04 | 1983-02-04 | 貴金属メツキ部を有する金属製品の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143071A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448653A (en) * | 1977-09-27 | 1979-04-17 | Toshiba Corp | Etching of metal plate |
-
1983
- 1983-02-04 JP JP1625383A patent/JPS59143071A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448653A (en) * | 1977-09-27 | 1979-04-17 | Toshiba Corp | Etching of metal plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0245708B2 (enrdf_load_stackoverflow) | 1990-10-11 |
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