JPH0240233B2 - - Google Patents
Info
- Publication number
- JPH0240233B2 JPH0240233B2 JP61248429A JP24842986A JPH0240233B2 JP H0240233 B2 JPH0240233 B2 JP H0240233B2 JP 61248429 A JP61248429 A JP 61248429A JP 24842986 A JP24842986 A JP 24842986A JP H0240233 B2 JPH0240233 B2 JP H0240233B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- layer
- wiring
- etching
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 39
- 238000007747 plating Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910017813 Cu—Cr Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24842986A JPS63104398A (ja) | 1986-10-21 | 1986-10-21 | 多層配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24842986A JPS63104398A (ja) | 1986-10-21 | 1986-10-21 | 多層配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63104398A JPS63104398A (ja) | 1988-05-09 |
| JPH0240233B2 true JPH0240233B2 (es) | 1990-09-10 |
Family
ID=17177991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24842986A Granted JPS63104398A (ja) | 1986-10-21 | 1986-10-21 | 多層配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63104398A (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636443U (ja) * | 1992-10-26 | 1994-05-17 | 正士 神志那 | 二段座板付椅子 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0286193A (ja) * | 1988-09-22 | 1990-03-27 | Fujitsu Ltd | 薄膜多層回路基板の製造方法 |
| JP2773366B2 (ja) * | 1990-03-19 | 1998-07-09 | 富士通株式会社 | 多層配線基板の形成方法 |
| JP2881270B2 (ja) * | 1990-08-28 | 1999-04-12 | 日本特殊陶業株式会社 | 多層配線基板の製造方法 |
| JP2749461B2 (ja) * | 1991-05-29 | 1998-05-13 | 京セラ株式会社 | 多層回路基板及びその製造方法 |
| JP2000340905A (ja) * | 1999-05-28 | 2000-12-08 | Toppan Printing Co Ltd | 光・電気配線基板及び製造方法並びに実装基板 |
| JP2001007529A (ja) * | 1999-06-23 | 2001-01-12 | Ibiden Co Ltd | 多層プリント配線板及び多層プリント配線板の製造方法、半導体チップ及び半導体チップの製造方法 |
| US8008188B2 (en) * | 2007-06-11 | 2011-08-30 | Ppg Industries Ohio, Inc. | Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials |
| JP6065359B2 (ja) * | 2011-11-24 | 2017-01-25 | 凸版印刷株式会社 | 貫通電極付き配線基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60134497A (ja) * | 1983-12-23 | 1985-07-17 | 株式会社日立製作所 | 配線基板およびその製造方法 |
-
1986
- 1986-10-21 JP JP24842986A patent/JPS63104398A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60134497A (ja) * | 1983-12-23 | 1985-07-17 | 株式会社日立製作所 | 配線基板およびその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636443U (ja) * | 1992-10-26 | 1994-05-17 | 正士 神志那 | 二段座板付椅子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63104398A (ja) | 1988-05-09 |
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