JPH0234184B2 - - Google Patents

Info

Publication number
JPH0234184B2
JPH0234184B2 JP56100337A JP10033781A JPH0234184B2 JP H0234184 B2 JPH0234184 B2 JP H0234184B2 JP 56100337 A JP56100337 A JP 56100337A JP 10033781 A JP10033781 A JP 10033781A JP H0234184 B2 JPH0234184 B2 JP H0234184B2
Authority
JP
Japan
Prior art keywords
package
terminals
printed circuit
connection terminals
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56100337A
Other languages
English (en)
Other versions
JPS582054A (ja
Inventor
Yasunori Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56100337A priority Critical patent/JPS582054A/ja
Priority to DE8282303255T priority patent/DE3277269D1/de
Priority to EP82303255A priority patent/EP0069505B1/en
Priority to US06/391,161 priority patent/US4530002A/en
Publication of JPS582054A publication Critical patent/JPS582054A/ja
Publication of JPH0234184B2 publication Critical patent/JPH0234184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Description

【発明の詳細な説明】 本発明は、半導体装置、特にパツケージより外
部に導出された外部回路と接続を取るための接続
用端子の構造の改良に関するものである。
従来よりIC、LSI等の半導体装置に用いられ、
前述した半導体素子を形成した半導体チツプを収
容するパツケージとしてはフラツト型パツケージ
およびプラグイン型パツケージが大形計算機にお
いて主として用いられている。
第１図は前記フラツト型パツケージの平面図で
第２図はプラグイン型のパツケージの側面図、第
３図は該プラグイン型パツケージの下部方向から
見た平面図である。図示するようにフラツト型パ
ツケージは半導体チツプを収容しているパツケー
ジ１より外部回路と接続をとるための接続端子２
が該パツケージの平面と平行に四方に延びる構造
となつており、プラグイン型パツケージはパツケ
ージ３の側面に平行に接続端子４が延びる構造と
なつている。
ところでこのようなパツケージに収容された半
導体装置をプリント基板に実装する場合、前記端
子が多数配列されているので一般に導体層を多層
構造に積層した積層型のプリント基板が用いられ
る。ここでフラツト型のパツケージでは、その端
子をプリント基板の最上層の信号線に直接圧着す
ることにより実装されるので、端子間隔を製造可
能なプリント基板の最小配線ピツチより小さくで
きない。
したがつてフラツト型のパツケージでは、パツ
ケージの平面に対して外側に向け平行に端子が延
びているので、端子数が多くなつた場合パツケー
ジの寸法が縦横両方向に大きくなりプリント基板
上での実装密度が下がる欠点がある。パツケージ
に塔載されるチツプは、その端子間隔はパツケー
ジの端子間隔およびプリント基板上の信号線間隔
より小さくすることが可能で、このため端子数が
増大するとフラツトパツケージの場合塔載するチ
ツプに対しパツケージの寸法が相対的に大きくな
つてしまう。このためパツケージの端子の直流抵
抗および自己インダクタンスが増加し、また端子
間の静電容量及び相互インダクタンスも増大し、
電気的な特性に悪影響を与える。
一方プラグイン型のパツケージはプリント基板
上に設けられたスルホールにその端子を挿入し半
田により固定される。またプラグイン型のパツケ
ージで高密度に集積化された半導体装置を収容す
る場合、前記接続端子がパツケージの側面に沿つ
て１列だけ配設されるのではなく複数列配設され
ることがあるが、この場合内側にある端子に接続
される信号線は外部回路と接続するために外側の
端子の間を通らなければならない。このためプラ
グイン型のパツケージの最外側端子のピツチはプ
リント基板において間に信号線を少なくとも１本
挾んだ場合のスルーホールの最少ピツチより小さ
くできない。この結果高集積度の論理LSI等でパ
ツケージの端子数が増加するとフラツト型パツケ
ージと同様にチツプ寸法に比較してパツケージの
寸法が大きくなり、プリント基板への実装密度が
下りまた電気的特性にも悪影響をおよぼす不都合
が生じる。
本発明は上述した欠点を除去した半導体装置の
パツケージを提供することを目的とするものであ
る。
かかる目的を達成するための半導体装置は半導
体素子を形成した半導体チツプが収容されたパツ
ケージから外部回路と接続王を取るために導出さ
れた複数列の接続端子のうちで、前記複数列の接
続端子の最外側の列の接続端子の垂直方向の長さ
が内側の列の接続端子の垂直方向の長さより短か
く形成されていることを特徴とするものである。
また前記パツケージに設けられた半導体素子の電
源用接続端子が前記素子の信号用接続端子より半
導体チツプに近接して設けられていることを特徴
とするものである。
以下図面を用いながら本発明の一実施例につき
詳細に説明する。
第４図は本発明の半導体装置のパツケージをプ
リント基板に実装した断面図で第５図は本発明の
半導体装置のパツケージの平面図で第６図は本発
明の半導体装置の第２の実施例のパツケージをプ
リント基板に実装した断面図を示す。ここで第４
図のパツケージは第５図のパツケージの平面図を
Ａ−A′線に沿つて切断した断面図となつている。
第４図、第５図に示すようにパツケージ１０に収
容された半導体チツプ１１より得られた電気的信
号を外部回路に接続するための信号線用端子はチ
ツプの周辺に複数列配設されているがその最外側
の信号線用端子１２，１３はフラツト型パツケー
ジの端子のようにパツケージの表面に平行に延び
ており第４図のプリント基板１４の表面に設けら
れた信号線用導体層１５，１６と融着することで
接続されている。
一方最外側より内部の信号線用端子１７，１８
は銅（Cu）等で形成されたスルホール１９，２
０を介してプリント基板１４に積層して形成され
た他の信号線用導体層２１，２２と接続されてい
る。
またパツケージに収容された半導体チツプ１１
を駆動させるための電源用端子２３，２４はスル
ホール２５，２６を介して電源端子駆動用導体層
２７，２８と接続されている。そしてこの電源用
端子２３，２４はパツケージに収容されている半
導体チツプ１１に最も近接して設置されているも
のとする。
ここで第４図、第５図においては図を簡単にす
るために信号線端子と電源用端子とをそれぞれ２
列づつ示したが、勿論実際のパツケージには縦横
に複数列の信号線用端子および電源用端子が設け
られているものとする。
第４図に示される本発明の実施例のようにパツ
ケージの最外側の端子をフラツト型パツケージの
端子と同様にパツケージの平面に平行に外向けに
端子を配列し、プリント基板の最上層の信号線に
熱圧着する実装方法にすると、パツケージの最外
側の端子はスルホールを必要とせず、パツケージ
の内側の端子に接続される信号線はプリント基板
上で最上層の他の信号線層を使つてパツケージの
外側に延びることができる。この場合パツケージ
の最外側端子にスルーホールがないため、内側の
端子に接続される信号線をパツケージの外側にと
り出す自由度が大きく、またパツケージの最外側
の端子ピツチに何らさまたげられることがない。
このためパツケージの最外側の端子ピツチもプ
リント基板およびパツケージの製造可能な範囲で
小さくでき、パツケージの寸法を従来に比べ縮少
することができ、プリント基板上の実装密度が上
りLSI1個当りのプリント基板コストで低下でき
る。またパツケージの内側の端子に接続される信
号線の取り出し方の自由度が大きいため、プリン
ト基板の層数も減少できる。またパツケージが小
さくできることからパツケージの電気的特性すな
わちパツケージの端子の直流抵抗、自己インダク
タンスおよび端子間の容量の相互インダクタンス
も改善することができる。
また電源用接続端子を半導体チツプに近接して
設けているので接続端子における電源電圧ドロツ
プを防ぐことができる。
更に本発明の第２の実施例を第６図に示す。図
示するようにパツケージ３１の最外側より導出さ
れる信号線用接続端子３２，３３の長さはその内
部に引き出される信号線用接続端子３４，３５よ
りも短かくしておき、プリント基板３６の表面に
形成した導体層３７，３８と接続するようにして
おく。
このようにすればパツケージの内側の端子に接
続される信号線をパツケージの外側へ取り出す際
の自由度は、第４図の実施例と同様に大きく、パ
ツケージの寸法を小さくでき、パツケージの電気
的特性の改善およびプリント基板のコストの低下
となる。
なお第４図、第５図または第６図におけるパツ
ケージの最外側の端子をリードレス型にしても良
い。
以上述べたように本発明の半導体装置のパツケ
ージを用いればプリント基板のコストも低減し、
またプリント基板に対して実装密度も向上し、パ
ツケージの電気的特性も向上し、またパツケージ
に塔載される半導体装置も電源の電圧ドロツプを
生じない等、高信頼度の半導体装置が得られる利
点を生じる。また、最も外側の列の接続端子は、
直接プリント基板表面に半田付けするため、半田
付け後でも外部から直接目視することができ、ま
た、内側列の接続端子も、プリント基板のスルー
ホールを貫通して基板に半田付けされるため、外
部から直接目視することができる。つまり、パツ
ケージの全ての接続端子がプリント基板に完全に
半田付けされたか否かを目視により容易に確認で
きるという効果を奏する。
【図面の簡単な説明】
第１図はフラツト型パツケージの平面図、第２
図はプラグイン型のパツケージの側面図、第３図
はプラグイン型のパツケージの平面図、第４図は
本発明のパツケージをプリント基板に実装した
図、第５図は本発明のパツケージの平面図、第６
図は本発明の第２の実施例のパツケージをプリン
ト基板に実装した図である。 図において、１，３，１０，３１はパツケー
ジ、２，４は端子、１１は半導体チツプ、１２，
１３，１７，１８，３２，３３，３４，３５は信
号線用端子、１４，３６はプリント基板、１５，
１６，２１，２２，３７，３８は信号線用導体
層、１９，２０，２５，２６はスルホール、２
３，２４は電源用端子、２７，２８は電源線用導
体層を示す。

Claims (1)

  1. 【特許請求の範囲】 １ 半導体チツプと、該半導体チツプを収容し且
    つ一主面に配設された複数の接続端子を具備する
    パツケージとを有し、 該接続端子が最も外側の列の接続端子と、内側
    列の接続端子とを有し、 該内側列の接続端子は基板の孔貫通用の接続端
    子であり、 該最も外側の列の全ての接続端子の縦方向の長
    さは、該内側列の接続端子の縦方向の長さよりも
    短く形成された、基板の表面接着用の接続端子で
    あることを特徴とする半導体装置。
JP56100337A 1981-06-26 1981-06-26 半導体装置 Granted JPS582054A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56100337A JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置
DE8282303255T DE3277269D1 (en) 1981-06-26 1982-06-22 Semiconductor device connection lead formation
EP82303255A EP0069505B1 (en) 1981-06-26 1982-06-22 Semiconductor device connection lead formation
US06/391,161 US4530002A (en) 1981-06-26 1982-06-22 Connection lead arrangement for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56100337A JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS582054A JPS582054A (ja) 1983-01-07
JPH0234184B2 true JPH0234184B2 (ja) 1990-08-01

Family

ID=14271316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56100337A Granted JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置

Country Status (4)

Country Link
US (1) US4530002A (ja)
EP (1) EP0069505B1 (ja)
JP (1) JPS582054A (ja)
DE (1) DE3277269D1 (ja)

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Also Published As

Publication number Publication date
EP0069505B1 (en) 1987-09-09
JPS582054A (ja) 1983-01-07
EP0069505A2 (en) 1983-01-12
US4530002A (en) 1985-07-16
EP0069505A3 (en) 1985-01-02
DE3277269D1 (en) 1987-10-15

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