JPH0233509B2 - - Google Patents

Info

Publication number
JPH0233509B2
JPH0233509B2 JP57021508A JP2150882A JPH0233509B2 JP H0233509 B2 JPH0233509 B2 JP H0233509B2 JP 57021508 A JP57021508 A JP 57021508A JP 2150882 A JP2150882 A JP 2150882A JP H0233509 B2 JPH0233509 B2 JP H0233509B2
Authority
JP
Japan
Prior art keywords
resin
mold
runner
lower mold
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57021508A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58138608A (ja
Inventor
Keigo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57021508A priority Critical patent/JPS58138608A/ja
Publication of JPS58138608A publication Critical patent/JPS58138608A/ja
Publication of JPH0233509B2 publication Critical patent/JPH0233509B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57021508A 1982-02-10 1982-02-10 樹脂封止形半導体装置用モ−ルド金型 Granted JPS58138608A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57021508A JPS58138608A (ja) 1982-02-10 1982-02-10 樹脂封止形半導体装置用モ−ルド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57021508A JPS58138608A (ja) 1982-02-10 1982-02-10 樹脂封止形半導体装置用モ−ルド金型

Publications (2)

Publication Number Publication Date
JPS58138608A JPS58138608A (ja) 1983-08-17
JPH0233509B2 true JPH0233509B2 (enExample) 1990-07-27

Family

ID=12056904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57021508A Granted JPS58138608A (ja) 1982-02-10 1982-02-10 樹脂封止形半導体装置用モ−ルド金型

Country Status (1)

Country Link
JP (1) JPS58138608A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4769380B2 (ja) * 2001-05-18 2011-09-07 ルネサスエレクトロニクス株式会社 クリーニング用シートおよびそれを用いた半導体装置の製造方法
CN114228017B (zh) * 2022-02-24 2022-04-29 南京博兰得电子科技有限公司 Dcdc转换器的成型装置、成型工艺及dcdc转换器

Also Published As

Publication number Publication date
JPS58138608A (ja) 1983-08-17

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