JPH02312296A - 高密度実装モジュールの製造方法 - Google Patents

高密度実装モジュールの製造方法

Info

Publication number
JPH02312296A
JPH02312296A JP1134180A JP13418089A JPH02312296A JP H02312296 A JPH02312296 A JP H02312296A JP 1134180 A JP1134180 A JP 1134180A JP 13418089 A JP13418089 A JP 13418089A JP H02312296 A JPH02312296 A JP H02312296A
Authority
JP
Japan
Prior art keywords
circuit pattern
board
component
hole
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1134180A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563112B2 (enrdf_load_stackoverflow
Inventor
Masaki Kinoshita
昌己 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Priority to JP1134180A priority Critical patent/JPH02312296A/ja
Publication of JPH02312296A publication Critical patent/JPH02312296A/ja
Publication of JPH0563112B2 publication Critical patent/JPH0563112B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1134180A 1989-05-26 1989-05-26 高密度実装モジュールの製造方法 Granted JPH02312296A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1134180A JPH02312296A (ja) 1989-05-26 1989-05-26 高密度実装モジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1134180A JPH02312296A (ja) 1989-05-26 1989-05-26 高密度実装モジュールの製造方法

Publications (2)

Publication Number Publication Date
JPH02312296A true JPH02312296A (ja) 1990-12-27
JPH0563112B2 JPH0563112B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=15122313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1134180A Granted JPH02312296A (ja) 1989-05-26 1989-05-26 高密度実装モジュールの製造方法

Country Status (1)

Country Link
JP (1) JPH02312296A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174648A (ja) * 1997-08-27 1999-03-16 Kyocera Corp 配線基板
JP2002118368A (ja) * 2000-07-31 2002-04-19 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
JP2002237683A (ja) * 2001-02-08 2002-08-23 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2003152317A (ja) * 2000-12-25 2003-05-23 Ngk Spark Plug Co Ltd 配線基板
US6581279B1 (en) * 1998-08-25 2003-06-24 Commissariat A L'energie Atomique Method of collectively packaging electronic components
JP2006351778A (ja) * 2005-06-15 2006-12-28 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2007258541A (ja) * 2006-03-24 2007-10-04 Ngk Spark Plug Co Ltd 配線基板の製造方法
US7435910B2 (en) 2000-02-25 2008-10-14 Ibiden Co., Ltd. Multilayer printed circuit board
KR100986829B1 (ko) * 2007-11-07 2010-10-12 삼성전기주식회사 반도체칩 및 이를 이용한 인쇄회로기판의 제조방법
US7852634B2 (en) 2000-09-25 2010-12-14 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
JP2014072279A (ja) * 2012-09-28 2014-04-21 Dainippon Printing Co Ltd 部品内蔵配線基板の製造方法

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174648A (ja) * 1997-08-27 1999-03-16 Kyocera Corp 配線基板
US6581279B1 (en) * 1998-08-25 2003-06-24 Commissariat A L'energie Atomique Method of collectively packaging electronic components
US7842887B2 (en) 2000-02-25 2010-11-30 Ibiden Co., Ltd. Multilayer printed circuit board
US8438727B2 (en) 2000-02-25 2013-05-14 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US8186045B2 (en) 2000-02-25 2012-05-29 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US8079142B2 (en) 2000-02-25 2011-12-20 Ibiden Co., Ltd. Printed circuit board manufacturing method
US7435910B2 (en) 2000-02-25 2008-10-14 Ibiden Co., Ltd. Multilayer printed circuit board
US7888606B2 (en) 2000-02-25 2011-02-15 Ibiden Co., Ltd. Multilayer printed circuit board
JP2002118368A (ja) * 2000-07-31 2002-04-19 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
US7999387B2 (en) 2000-09-25 2011-08-16 Ibiden Co., Ltd. Semiconductor element connected to printed circuit board
US7852634B2 (en) 2000-09-25 2010-12-14 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US7855342B2 (en) 2000-09-25 2010-12-21 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US7893360B2 (en) 2000-09-25 2011-02-22 Ibiden Co., Ltd. Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US7908745B2 (en) 2000-09-25 2011-03-22 Ibiden Co., Ltd. Method of manufacturing multi-layer printed circuit board
US8959756B2 (en) 2000-09-25 2015-02-24 Ibiden Co., Ltd. Method of manufacturing a printed circuit board having an embedded electronic component
US9245838B2 (en) 2000-09-25 2016-01-26 Ibiden Co., Ltd. Semiconductor element
JP2003152317A (ja) * 2000-12-25 2003-05-23 Ngk Spark Plug Co Ltd 配線基板
JP2002237683A (ja) * 2001-02-08 2002-08-23 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2006351778A (ja) * 2005-06-15 2006-12-28 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2007258541A (ja) * 2006-03-24 2007-10-04 Ngk Spark Plug Co Ltd 配線基板の製造方法
KR100986829B1 (ko) * 2007-11-07 2010-10-12 삼성전기주식회사 반도체칩 및 이를 이용한 인쇄회로기판의 제조방법
JP2014072279A (ja) * 2012-09-28 2014-04-21 Dainippon Printing Co Ltd 部品内蔵配線基板の製造方法

Also Published As

Publication number Publication date
JPH0563112B2 (enrdf_load_stackoverflow) 1993-09-09

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