JPH0226650B2 - - Google Patents
Info
- Publication number
- JPH0226650B2 JPH0226650B2 JP58068047A JP6804783A JPH0226650B2 JP H0226650 B2 JPH0226650 B2 JP H0226650B2 JP 58068047 A JP58068047 A JP 58068047A JP 6804783 A JP6804783 A JP 6804783A JP H0226650 B2 JPH0226650 B2 JP H0226650B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- polyphenylene oxide
- heat resistance
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6804783A JPS59193929A (ja) | 1983-04-18 | 1983-04-18 | 熱可塑性樹脂積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6804783A JPS59193929A (ja) | 1983-04-18 | 1983-04-18 | 熱可塑性樹脂積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59193929A JPS59193929A (ja) | 1984-11-02 |
| JPH0226650B2 true JPH0226650B2 (cs) | 1990-06-12 |
Family
ID=13362478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6804783A Granted JPS59193929A (ja) | 1983-04-18 | 1983-04-18 | 熱可塑性樹脂積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59193929A (cs) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62148512A (ja) * | 1985-12-23 | 1987-07-02 | Matsushita Electric Works Ltd | ポリフエニレンオキサイド固化物の改質法 |
| JP5261943B2 (ja) * | 2006-02-17 | 2013-08-14 | 日立化成株式会社 | セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| TWI441866B (zh) | 2006-02-17 | 2014-06-21 | Hitachi Chemical Co Ltd | A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate |
| JP5303852B2 (ja) * | 2006-04-13 | 2013-10-02 | 日立化成株式会社 | セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP5303853B2 (ja) * | 2006-04-14 | 2013-10-02 | 日立化成株式会社 | Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP5303854B2 (ja) * | 2006-10-24 | 2013-10-02 | 日立化成株式会社 | 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP5374891B2 (ja) * | 2007-04-25 | 2013-12-25 | 日立化成株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| TWI513761B (zh) | 2013-04-30 | 2015-12-21 | Ind Tech Res Inst | 樹脂組合物、膠片、及包含其之基材 |
| SG11201609185TA (en) | 2014-04-04 | 2016-12-29 | Hitachi Chemical Co Ltd | Polyphenylene ether derivative having n-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same |
| SG11201705654PA (en) | 2015-01-13 | 2017-08-30 | Hitachi Chemical Co Ltd | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5118025B2 (cs) * | 1972-08-25 | 1976-06-07 | ||
| JPS5213227B2 (cs) * | 1973-01-16 | 1977-04-13 | ||
| JPS56115350A (en) * | 1980-02-16 | 1981-09-10 | Asahi Chem Ind Co Ltd | Modified block copolymer composition |
| JPS57202333A (en) * | 1981-06-08 | 1982-12-11 | Shin Etsu Polymer Co Ltd | Composition having high dielectric constant |
-
1983
- 1983-04-18 JP JP6804783A patent/JPS59193929A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59193929A (ja) | 1984-11-02 |
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