JPH0225254B2 - - Google Patents

Info

Publication number
JPH0225254B2
JPH0225254B2 JP61216690A JP21669086A JPH0225254B2 JP H0225254 B2 JPH0225254 B2 JP H0225254B2 JP 61216690 A JP61216690 A JP 61216690A JP 21669086 A JP21669086 A JP 21669086A JP H0225254 B2 JPH0225254 B2 JP H0225254B2
Authority
JP
Japan
Prior art keywords
silicon wafer
suction disk
orientation flat
movable
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61216690A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6372138A (ja
Inventor
Susumu Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METSUKUSU KK
Original Assignee
METSUKUSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METSUKUSU KK filed Critical METSUKUSU KK
Priority to JP61216690A priority Critical patent/JPS6372138A/ja
Priority to US07/071,958 priority patent/US4770600A/en
Publication of JPS6372138A publication Critical patent/JPS6372138A/ja
Publication of JPH0225254B2 publication Critical patent/JPH0225254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Position Or Direction (AREA)
JP61216690A 1986-09-12 1986-09-12 シリコンウエハ−の位置決め装置 Granted JPS6372138A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61216690A JPS6372138A (ja) 1986-09-12 1986-09-12 シリコンウエハ−の位置決め装置
US07/071,958 US4770600A (en) 1986-09-12 1987-07-10 Apparatus for positioning silicon wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61216690A JPS6372138A (ja) 1986-09-12 1986-09-12 シリコンウエハ−の位置決め装置

Publications (2)

Publication Number Publication Date
JPS6372138A JPS6372138A (ja) 1988-04-01
JPH0225254B2 true JPH0225254B2 (US20110009641A1-20110113-C00116.png) 1990-06-01

Family

ID=16692395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61216690A Granted JPS6372138A (ja) 1986-09-12 1986-09-12 シリコンウエハ−の位置決め装置

Country Status (2)

Country Link
US (1) US4770600A (US20110009641A1-20110113-C00116.png)
JP (1) JPS6372138A (US20110009641A1-20110113-C00116.png)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880348A (en) * 1987-05-15 1989-11-14 Roboptek, Inc. Wafer centration device
DE68911330T2 (de) * 1988-02-08 1994-05-26 Toshiba Kawasaki Kk Vorrichtung mit einem Ausrichtungsgestell.
JPH0736417B2 (ja) * 1989-10-24 1995-04-19 株式会社メツクス ウエハーの位置決め装置
US5344521A (en) * 1991-04-10 1994-09-06 Canon Kabushiki Kaisha Coating film separating device and coating film separation method using the device
JP3074313B2 (ja) * 1993-01-26 2000-08-07 株式会社メックス ウエハーの位置決め装置
KR0165350B1 (ko) * 1995-12-13 1999-02-18 김광호 반도체웨이퍼 공급장치
JPH09213769A (ja) * 1996-01-31 1997-08-15 Komatsu Electron Metals Co Ltd 半導体ウェハの搬送装置
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6185830B1 (en) * 1999-03-25 2001-02-13 Lucent Technologies, Inc. Semiconductor wafer fixture for alignment in a grating exposure process
US6275742B1 (en) 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
JP4173309B2 (ja) * 2002-01-28 2008-10-29 東京エレクトロン株式会社 センタリング装置及び枚葉式検査装置
JP3956350B2 (ja) * 2002-03-25 2007-08-08 東京エレクトロン株式会社 位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法
US6779278B1 (en) * 2003-07-17 2004-08-24 Nanometrics Incorporated Compact rotating stage
JP2007005690A (ja) * 2005-06-27 2007-01-11 Fujifilm Holdings Corp 半導体装置用検査装置およびこれを用いた半導体装置の検査方法
US7921895B2 (en) * 2006-05-26 2011-04-12 Advanced Display Process Engineering Co., Ltd Adhesive chuck, and apparatus and method for assembling substrates using the same
JP2008103544A (ja) * 2006-10-19 2008-05-01 Yaskawa Electric Corp アライナー装置
JP5049983B2 (ja) * 2009-01-07 2012-10-17 本田技研工業株式会社 収納装置
JP6215059B2 (ja) * 2014-01-10 2017-10-18 株式会社ディスコ マーク検出方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416984A (en) * 1977-07-08 1979-02-07 Hitachi Ltd Wafer locating device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024944A (en) * 1975-12-24 1977-05-24 Texas Instruments Incorporated Semiconductor slice prealignment system
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4662811A (en) * 1983-07-25 1987-05-05 Hayden Thomas J Method and apparatus for orienting semiconductor wafers
JPH0610775B2 (ja) * 1984-12-05 1994-02-09 株式会社ニコン 円形基板の位置決め装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416984A (en) * 1977-07-08 1979-02-07 Hitachi Ltd Wafer locating device

Also Published As

Publication number Publication date
JPS6372138A (ja) 1988-04-01
US4770600A (en) 1988-09-13

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