JPH0221425B2 - - Google Patents
Info
- Publication number
- JPH0221425B2 JPH0221425B2 JP59111014A JP11101484A JPH0221425B2 JP H0221425 B2 JPH0221425 B2 JP H0221425B2 JP 59111014 A JP59111014 A JP 59111014A JP 11101484 A JP11101484 A JP 11101484A JP H0221425 B2 JPH0221425 B2 JP H0221425B2
- Authority
- JP
- Japan
- Prior art keywords
- paper
- release
- curing
- release paper
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 10
- 230000035699 permeability Effects 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 239000000049 pigment Substances 0.000 claims description 4
- 239000004651 Radiation Curable Silicone Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 description 33
- 238000001723 curing Methods 0.000 description 25
- 239000010410 layer Substances 0.000 description 17
- -1 polyethylene Polymers 0.000 description 14
- 239000004698 Polyethylene Substances 0.000 description 12
- 229920000573 polyethylene Polymers 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 9
- 229920001684 low density polyethylene Polymers 0.000 description 9
- 239000004702 low-density polyethylene Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000010894 electron beam technology Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000005187 foaming Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 4
- 239000002649 leather substitute Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000005033 polyvinylidene chloride Substances 0.000 description 4
- 238000003847 radiation curing Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000001227 electron beam curing Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical group O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- APEJMQOBVMLION-UHFFFAOYSA-N cinnamamide Chemical group NC(=O)C=CC1=CC=CC=C1 APEJMQOBVMLION-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical group CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Paper (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11101484A JPS60258280A (ja) | 1984-06-01 | 1984-06-01 | 剥離紙 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11101484A JPS60258280A (ja) | 1984-06-01 | 1984-06-01 | 剥離紙 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60258280A JPS60258280A (ja) | 1985-12-20 |
| JPH0221425B2 true JPH0221425B2 (de) | 1990-05-14 |
Family
ID=14550206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11101484A Granted JPS60258280A (ja) | 1984-06-01 | 1984-06-01 | 剥離紙 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60258280A (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0815961B2 (ja) * | 1987-10-19 | 1996-02-21 | 積水化学工業株式会社 | 感圧性粘着テープ捲重体 |
| US4867828A (en) * | 1987-11-02 | 1989-09-19 | Acumeter Laboratories, Inc. | Method of in-line production of successive barrier-and silicone-coated inexpensive porous and absorbent paper and similar substrates, and products produced thereby |
| JPH0813592B2 (ja) * | 1988-10-20 | 1996-02-14 | 株式会社巴川製紙所 | 券紙の製造方法 |
| JPH0423876A (ja) * | 1990-05-17 | 1992-01-28 | Koopack Kk | 剥離紙 |
| JPH04174798A (ja) * | 1990-11-05 | 1992-06-22 | Sekisui Chem Co Ltd | 剥離紙 |
| US7700151B2 (en) | 2003-04-11 | 2010-04-20 | Henkel Ag & Co. Kgaa | Process for making pressure sensitive adhesive tapes from cationic cure adhesives |
| WO2007149258A2 (en) * | 2006-06-08 | 2007-12-27 | International Paper Company | Paper substrates containing a silicon-containing compound |
| JP5659937B2 (ja) * | 2011-04-18 | 2015-01-28 | 王子ホールディングス株式会社 | 剥離紙 |
| JP6252567B2 (ja) * | 2015-09-03 | 2017-12-27 | 王子ホールディングス株式会社 | 剥離シート、剥離シートの製造方法及び積層体 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816059B1 (de) * | 1970-04-03 | 1973-05-19 | Japan Synthetic Rubber Co Ltd | |
| JPS546512A (en) * | 1977-06-13 | 1979-01-18 | Peters Joseph Jr | Pitch variation limiting device for string instrument |
| JPS57187221A (en) * | 1981-05-13 | 1982-11-17 | Fujimori Kogyo Kk | Manufacture of stripping paper |
| JPS5815537A (ja) * | 1981-07-22 | 1983-01-28 | Fujimori Kogyo Kk | 剥離紙の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816059U (de) * | 1971-05-27 | 1973-02-23 | ||
| JPS5187661U (de) * | 1975-01-08 | 1976-07-14 |
-
1984
- 1984-06-01 JP JP11101484A patent/JPS60258280A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816059B1 (de) * | 1970-04-03 | 1973-05-19 | Japan Synthetic Rubber Co Ltd | |
| JPS546512A (en) * | 1977-06-13 | 1979-01-18 | Peters Joseph Jr | Pitch variation limiting device for string instrument |
| JPS57187221A (en) * | 1981-05-13 | 1982-11-17 | Fujimori Kogyo Kk | Manufacture of stripping paper |
| JPS5815537A (ja) * | 1981-07-22 | 1983-01-28 | Fujimori Kogyo Kk | 剥離紙の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60258280A (ja) | 1985-12-20 |
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