JPH0219969B2 - - Google Patents
Info
- Publication number
- JPH0219969B2 JPH0219969B2 JP57085677A JP8567782A JPH0219969B2 JP H0219969 B2 JPH0219969 B2 JP H0219969B2 JP 57085677 A JP57085677 A JP 57085677A JP 8567782 A JP8567782 A JP 8567782A JP H0219969 B2 JPH0219969 B2 JP H0219969B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- processing
- opening
- wire conveyor
- plasma reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 148
- 238000006243 chemical reaction Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 9
- 230000007723 transport mechanism Effects 0.000 claims description 6
- 230000003028 elevating effect Effects 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Feeding Of Workpieces (AREA)
- Structure Of Belt Conveyors (AREA)
- Framework For Endless Conveyors (AREA)
- Drying Of Semiconductors (AREA)
- Automatic Assembly (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8567782A JPS5840828A (ja) | 1982-05-22 | 1982-05-22 | 自動枚葉処理型プラズマ反応処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8567782A JPS5840828A (ja) | 1982-05-22 | 1982-05-22 | 自動枚葉処理型プラズマ反応処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5840828A JPS5840828A (ja) | 1983-03-09 |
JPH0219969B2 true JPH0219969B2 (ko) | 1990-05-07 |
Family
ID=13865459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8567782A Granted JPS5840828A (ja) | 1982-05-22 | 1982-05-22 | 自動枚葉処理型プラズマ反応処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5840828A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616488B2 (ja) * | 1985-12-02 | 1994-03-02 | 東芝機械株式会社 | 半導体製造装置 |
JP2544145Y2 (ja) * | 1988-03-31 | 1997-08-13 | 株式会社南雲製作所 | プリント基板の自動面取り装置 |
JP3297831B2 (ja) * | 1994-12-29 | 2002-07-02 | ソニー株式会社 | 搬送装置 |
JP6379017B2 (ja) * | 2014-11-20 | 2018-08-22 | 東京技研工業株式会社 | ワイヤー搬送装置用間隔調整具 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5421174A (en) * | 1977-07-18 | 1979-02-17 | Tokyo Ouka Kougiyou Kk | Plasma reaction processor |
JPS5457867A (en) * | 1977-10-17 | 1979-05-10 | Nichiden Varian Kk | Vacuum processor with automatic wafer feeder |
-
1982
- 1982-05-22 JP JP8567782A patent/JPS5840828A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5421174A (en) * | 1977-07-18 | 1979-02-17 | Tokyo Ouka Kougiyou Kk | Plasma reaction processor |
JPS5457867A (en) * | 1977-10-17 | 1979-05-10 | Nichiden Varian Kk | Vacuum processor with automatic wafer feeder |
Also Published As
Publication number | Publication date |
---|---|
JPS5840828A (ja) | 1983-03-09 |
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