JPH054282Y2 - - Google Patents
Info
- Publication number
- JPH054282Y2 JPH054282Y2 JP1984184188U JP18418884U JPH054282Y2 JP H054282 Y2 JPH054282 Y2 JP H054282Y2 JP 1984184188 U JP1984184188 U JP 1984184188U JP 18418884 U JP18418884 U JP 18418884U JP H054282 Y2 JPH054282 Y2 JP H054282Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- processing chamber
- mounting table
- chuck ring
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 29
- 238000004891 communication Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984184188U JPH054282Y2 (ko) | 1984-12-04 | 1984-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984184188U JPH054282Y2 (ko) | 1984-12-04 | 1984-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197841U JPS6197841U (ko) | 1986-06-23 |
| JPH054282Y2 true JPH054282Y2 (ko) | 1993-02-02 |
Family
ID=30741673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984184188U Expired - Lifetime JPH054282Y2 (ko) | 1984-12-04 | 1984-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054282Y2 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3750502T2 (de) * | 1986-12-19 | 1995-01-12 | Applied Materials Inc | Plasmaätzvorrichtung mit Magnetfeldverstärkung. |
| JP2673538B2 (ja) * | 1988-05-02 | 1997-11-05 | 東京エレクトロン株式会社 | エッチング装置及びエッチング方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741064A (en) * | 1980-08-25 | 1982-03-06 | Nec Corp | Digital board trunk |
| JPS58178533A (ja) * | 1982-04-14 | 1983-10-19 | Hitachi Ltd | ウエ−ハ押上げ装置 |
-
1984
- 1984-12-04 JP JP1984184188U patent/JPH054282Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741064A (en) * | 1980-08-25 | 1982-03-06 | Nec Corp | Digital board trunk |
| JPS58178533A (ja) * | 1982-04-14 | 1983-10-19 | Hitachi Ltd | ウエ−ハ押上げ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197841U (ko) | 1986-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6044534A (en) | Semiconductor device manufacturing machine and method for manufacturing a semiconductor device by using the same manufacturing machine | |
| JP6632403B2 (ja) | 基板収納容器の連結機構および連結方法 | |
| US5445491A (en) | Method for multichamber sheet-after-sheet type treatment | |
| KR100639765B1 (ko) | 기판 처리 장치, 기판 처리 방법 및 반도체 장치의 제조방법 | |
| US5376212A (en) | Reduced-pressure processing apparatus | |
| JP4935987B2 (ja) | イオン注入機と共に使用するための移送装置及びその方法 | |
| EP0555891A2 (en) | Vacuum processing system | |
| JPH0249424A (ja) | エッチング方法 | |
| KR101106803B1 (ko) | 반도체 웨이퍼 처리용 반도체 제조 시스템, 대기중 로봇핸들링 장비 및 반도체 웨이퍼의 반송 방법 | |
| JPH054282Y2 (ko) | ||
| CN106898566B (zh) | 一种半导体加工设备 | |
| KR100433067B1 (ko) | 반도체 제조장치 | |
| JP3200460B2 (ja) | 成膜処理装置 | |
| JP4083306B2 (ja) | プラズマ処理後におけるリンス方法 | |
| WO1991007773A1 (fr) | Procede de traitement sous vide d'un substrat et appareil utilise | |
| JP2767142B2 (ja) | 真空処理装置用ユニット | |
| JP3035436B2 (ja) | 基板処理装置 | |
| KR100774711B1 (ko) | 반도체 제조용 에피택셜 장비의 파티클 제거 장치 및 제거방법 | |
| JP2939378B2 (ja) | 真空処理装置 | |
| JPS63229829A (ja) | 薄板状体の加熱装置 | |
| JPH05140743A (ja) | 真空処理装置 | |
| JP2004011005A (ja) | 処理装置および処理方法 | |
| JPH07201951A (ja) | 処理装置及びその使用方法 | |
| JPH11102952A (ja) | 半導体製造方法及びその装置 | |
| JPS61119040A (ja) | 真空処理装置 |