JPH0218950A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JPH0218950A
JPH0218950A JP16965488A JP16965488A JPH0218950A JP H0218950 A JPH0218950 A JP H0218950A JP 16965488 A JP16965488 A JP 16965488A JP 16965488 A JP16965488 A JP 16965488A JP H0218950 A JPH0218950 A JP H0218950A
Authority
JP
Japan
Prior art keywords
wiring
film
interlayer insulating
insulating film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16965488A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0581181B2 (cs
Inventor
Moriya Nakahara
中原　守弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16965488A priority Critical patent/JPH0218950A/ja
Priority to US07/376,655 priority patent/US5110762A/en
Publication of JPH0218950A publication Critical patent/JPH0218950A/ja
Publication of JPH0581181B2 publication Critical patent/JPH0581181B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP16965488A 1988-07-07 1988-07-07 半導体装置及びその製造方法 Granted JPH0218950A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP16965488A JPH0218950A (ja) 1988-07-07 1988-07-07 半導体装置及びその製造方法
US07/376,655 US5110762A (en) 1988-07-07 1989-07-07 Manufacturing a wiring formed inside a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16965488A JPH0218950A (ja) 1988-07-07 1988-07-07 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH0218950A true JPH0218950A (ja) 1990-01-23
JPH0581181B2 JPH0581181B2 (cs) 1993-11-11

Family

ID=15890472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16965488A Granted JPH0218950A (ja) 1988-07-07 1988-07-07 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPH0218950A (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0296331A (ja) * 1988-09-30 1990-04-09 Texas Instr Japan Ltd 半導体装置及びその製造方法
DE4113741A1 (de) * 1990-11-06 1992-05-07 Mitsubishi Electric Corp Halbleitereinrichtung und verfahren zu deren herstellung
JPH06224190A (ja) * 1992-10-30 1994-08-12 Hyundai Electron Ind Co Ltd タングステンプラグの製造方法
JPH09306993A (ja) * 1996-05-16 1997-11-28 Lg Semicon Co Ltd 半導体装置の配線形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0296331A (ja) * 1988-09-30 1990-04-09 Texas Instr Japan Ltd 半導体装置及びその製造方法
DE4113741A1 (de) * 1990-11-06 1992-05-07 Mitsubishi Electric Corp Halbleitereinrichtung und verfahren zu deren herstellung
JPH06224190A (ja) * 1992-10-30 1994-08-12 Hyundai Electron Ind Co Ltd タングステンプラグの製造方法
JPH09306993A (ja) * 1996-05-16 1997-11-28 Lg Semicon Co Ltd 半導体装置の配線形成方法

Also Published As

Publication number Publication date
JPH0581181B2 (cs) 1993-11-11

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Legal Events

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