JPH0217950B2 - - Google Patents
Info
- Publication number
- JPH0217950B2 JPH0217950B2 JP18107281A JP18107281A JPH0217950B2 JP H0217950 B2 JPH0217950 B2 JP H0217950B2 JP 18107281 A JP18107281 A JP 18107281A JP 18107281 A JP18107281 A JP 18107281A JP H0217950 B2 JPH0217950 B2 JP H0217950B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- base material
- hydrochloric acid
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18107281A JPS5884488A (ja) | 1981-11-13 | 1981-11-13 | 印刷回路用銅張積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18107281A JPS5884488A (ja) | 1981-11-13 | 1981-11-13 | 印刷回路用銅張積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5884488A JPS5884488A (ja) | 1983-05-20 |
| JPH0217950B2 true JPH0217950B2 (cs) | 1990-04-24 |
Family
ID=16094305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18107281A Granted JPS5884488A (ja) | 1981-11-13 | 1981-11-13 | 印刷回路用銅張積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5884488A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61144339A (ja) * | 1984-12-19 | 1986-07-02 | 日立化成工業株式会社 | 金属コアエポキシ樹脂銅張積層板の製造方法 |
| JPS6392090A (ja) * | 1986-10-06 | 1988-04-22 | 三井金属鉱業株式会社 | 多層回路基板の製造法 |
| JP4572423B2 (ja) * | 1998-03-17 | 2010-11-04 | 日立化成工業株式会社 | 銅張積層板の製造方法及びこれを用いたプリント配線板、多層プリント配線板 |
| JP2008111188A (ja) * | 2007-09-25 | 2008-05-15 | Hitachi Chem Co Ltd | プリント配線板用の銅箔 |
| JP4924326B2 (ja) * | 2007-09-25 | 2012-04-25 | 日立化成工業株式会社 | プリント配線板用の銅箔 |
-
1981
- 1981-11-13 JP JP18107281A patent/JPS5884488A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5884488A (ja) | 1983-05-20 |
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