JPH0217949B2 - - Google Patents

Info

Publication number
JPH0217949B2
JPH0217949B2 JP3780484A JP3780484A JPH0217949B2 JP H0217949 B2 JPH0217949 B2 JP H0217949B2 JP 3780484 A JP3780484 A JP 3780484A JP 3780484 A JP3780484 A JP 3780484A JP H0217949 B2 JPH0217949 B2 JP H0217949B2
Authority
JP
Japan
Prior art keywords
solder
component
circuit board
printed circuit
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3780484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60182796A (ja
Inventor
Akira Fujii
Osamu Ooshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3780484A priority Critical patent/JPS60182796A/ja
Publication of JPS60182796A publication Critical patent/JPS60182796A/ja
Publication of JPH0217949B2 publication Critical patent/JPH0217949B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP3780484A 1984-02-29 1984-02-29 部品取付け方法 Granted JPS60182796A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3780484A JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3780484A JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Publications (2)

Publication Number Publication Date
JPS60182796A JPS60182796A (ja) 1985-09-18
JPH0217949B2 true JPH0217949B2 (enrdf_load_stackoverflow) 1990-04-24

Family

ID=12507696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3780484A Granted JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Country Status (1)

Country Link
JP (1) JPS60182796A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0448266B1 (en) * 1990-03-23 1996-06-05 Motorola, Inc. Surface mountable semiconductor device having self loaded solder joints
JP3202221B2 (ja) * 1990-11-22 2001-08-27 日本たばこ産業株式会社 シガレットの製造方法及び装置

Also Published As

Publication number Publication date
JPS60182796A (ja) 1985-09-18

Similar Documents

Publication Publication Date Title
KR940000747B1 (ko) 고밀도 솔더범프 형성 및 솔더범프된 부재 부착방법
JPH0217949B2 (enrdf_load_stackoverflow)
JPH03187228A (ja) 半田バンプの形成方法
JP3180041B2 (ja) 接続端子及びその形成方法
JPH0312993A (ja) 電子回路パッケージにおける半田付け方法
JPH01192466A (ja) はんだ除去プレート
JP2625973B2 (ja) 半田供給方法
JPH08316619A (ja) プリント配線板及びその製造方法
JPH05129753A (ja) デイスクリート部品およびデイスクリート部品のプリント基板実装方法
JPS59207690A (ja) 集積回路素子の実装方法
JPH0917913A (ja) 電子回路装置
JP3795599B2 (ja) はんだ転写方法
JPH04315494A (ja) 回路部品へのワイヤ接続方法
JPS59186388A (ja) プリント基板の接続方法
JPH0142353Y2 (enrdf_load_stackoverflow)
JPS6129159B2 (enrdf_load_stackoverflow)
JPH10189666A (ja) 半田ボール搭載用キャリアフィルム及びその製造方法ならびに半田ボール搭載方法
JPS60182797A (ja) 部品の取付け方法
JP2804813B2 (ja) リードの固着方法
JPS61290799A (ja) 電子部品の製造方法
JPS5824940B2 (ja) ハンドウタイソシノジツソウホウホウ
JPH066022A (ja) 部品実装方法
JPH0831558B2 (ja) 半導体装置の組立方法
JP2005203664A (ja) 半導体装置の実装方法
JPH10150262A (ja) チップの実装方法