JPH02166753A - 半導体封止用樹脂成形材料 - Google Patents
半導体封止用樹脂成形材料Info
- Publication number
- JPH02166753A JPH02166753A JP32281088A JP32281088A JPH02166753A JP H02166753 A JPH02166753 A JP H02166753A JP 32281088 A JP32281088 A JP 32281088A JP 32281088 A JP32281088 A JP 32281088A JP H02166753 A JPH02166753 A JP H02166753A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding material
- inorganic base
- base material
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 239000012778 molding material Substances 0.000 title claims abstract description 35
- 238000007789 sealing Methods 0.000 title abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 18
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005538 encapsulation Methods 0.000 claims description 28
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract description 22
- 239000003822 epoxy resin Substances 0.000 abstract description 17
- 229920000647 polyepoxide Polymers 0.000 abstract description 17
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 239000013078 crystal Substances 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 11
- 230000035882 stress Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- -1 curing accelerators Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000013441 quality evaluation Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32281088A JPH02166753A (ja) | 1988-12-21 | 1988-12-21 | 半導体封止用樹脂成形材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32281088A JPH02166753A (ja) | 1988-12-21 | 1988-12-21 | 半導体封止用樹脂成形材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02166753A true JPH02166753A (ja) | 1990-06-27 |
| JPH0587182B2 JPH0587182B2 (enExample) | 1993-12-15 |
Family
ID=18147871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32281088A Granted JPH02166753A (ja) | 1988-12-21 | 1988-12-21 | 半導体封止用樹脂成形材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02166753A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06293024A (ja) * | 1993-04-09 | 1994-10-21 | Shin Etsu Chem Co Ltd | 半導体封止用成形材料の製造方法 |
| WO2002091465A1 (fr) | 2001-04-23 | 2002-11-14 | Shin-Etsu Chemical Co., Ltd. | Element a rayonnement thermique |
| JP2010270262A (ja) * | 2009-05-22 | 2010-12-02 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物、及び該組成物を用いて半導体素子が封止された半導体装置 |
| JP2012007077A (ja) * | 2010-06-24 | 2012-01-12 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
| WO2015083340A1 (ja) * | 2013-12-06 | 2015-06-11 | ナガセケムテックス株式会社 | 熱硬化性樹脂組成物および熱伝導性シート |
| CN104798194A (zh) * | 2013-01-11 | 2015-07-22 | 三菱电机株式会社 | 半导体器件 |
| JP2019192673A (ja) * | 2018-04-18 | 2019-10-31 | 富士電機株式会社 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62101649A (ja) * | 1985-10-30 | 1987-05-12 | Hitachi Chem Co Ltd | 半導体封止用熱硬化性樹脂組成物 |
-
1988
- 1988-12-21 JP JP32281088A patent/JPH02166753A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62101649A (ja) * | 1985-10-30 | 1987-05-12 | Hitachi Chem Co Ltd | 半導体封止用熱硬化性樹脂組成物 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06293024A (ja) * | 1993-04-09 | 1994-10-21 | Shin Etsu Chem Co Ltd | 半導体封止用成形材料の製造方法 |
| WO2002091465A1 (fr) | 2001-04-23 | 2002-11-14 | Shin-Etsu Chemical Co., Ltd. | Element a rayonnement thermique |
| CN100433310C (zh) * | 2001-04-23 | 2008-11-12 | 信越化学工业株式会社 | 散热元件 |
| US7484556B2 (en) | 2001-04-23 | 2009-02-03 | Shin-Etsu Chemical Co., Ltd. | Heat dissipating member |
| JP2010270262A (ja) * | 2009-05-22 | 2010-12-02 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物、及び該組成物を用いて半導体素子が封止された半導体装置 |
| JP2012007077A (ja) * | 2010-06-24 | 2012-01-12 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
| CN104798194A (zh) * | 2013-01-11 | 2015-07-22 | 三菱电机株式会社 | 半导体器件 |
| US9293390B2 (en) | 2013-01-11 | 2016-03-22 | Mitsubishi Electric Corporation | Heat radiation structure for semiconductor device |
| DE112013006402B4 (de) | 2013-01-11 | 2024-07-04 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| WO2015083340A1 (ja) * | 2013-12-06 | 2015-06-11 | ナガセケムテックス株式会社 | 熱硬化性樹脂組成物および熱伝導性シート |
| JP2015110709A (ja) * | 2013-12-06 | 2015-06-18 | ナガセケムテックス株式会社 | 熱硬化性樹脂組成物および熱伝導性シート |
| JP2019192673A (ja) * | 2018-04-18 | 2019-10-31 | 富士電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0587182B2 (enExample) | 1993-12-15 |
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