JPH0587182B2 - - Google Patents

Info

Publication number
JPH0587182B2
JPH0587182B2 JP63322810A JP32281088A JPH0587182B2 JP H0587182 B2 JPH0587182 B2 JP H0587182B2 JP 63322810 A JP63322810 A JP 63322810A JP 32281088 A JP32281088 A JP 32281088A JP H0587182 B2 JPH0587182 B2 JP H0587182B2
Authority
JP
Japan
Prior art keywords
resin
molding material
semiconductor encapsulation
encapsulation
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63322810A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02166753A (ja
Inventor
Hideki Okabe
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP32281088A priority Critical patent/JPH02166753A/ja
Publication of JPH02166753A publication Critical patent/JPH02166753A/ja
Publication of JPH0587182B2 publication Critical patent/JPH0587182B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP32281088A 1988-12-21 1988-12-21 半導体封止用樹脂成形材料 Granted JPH02166753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32281088A JPH02166753A (ja) 1988-12-21 1988-12-21 半導体封止用樹脂成形材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32281088A JPH02166753A (ja) 1988-12-21 1988-12-21 半導体封止用樹脂成形材料

Publications (2)

Publication Number Publication Date
JPH02166753A JPH02166753A (ja) 1990-06-27
JPH0587182B2 true JPH0587182B2 (enExample) 1993-12-15

Family

ID=18147871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32281088A Granted JPH02166753A (ja) 1988-12-21 1988-12-21 半導体封止用樹脂成形材料

Country Status (1)

Country Link
JP (1) JPH02166753A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929896B2 (ja) * 1993-04-09 1999-08-03 信越化学工業株式会社 半導体封止用成形材料の製造方法
KR100623442B1 (ko) 2001-04-23 2006-09-18 신에쓰 가가꾸 고교 가부시끼가이샤 방열부재
JP2010270262A (ja) * 2009-05-22 2010-12-02 Panasonic Electric Works Co Ltd 半導体封止用エポキシ樹脂組成物、及び該組成物を用いて半導体素子が封止された半導体装置
JP5592174B2 (ja) * 2010-06-24 2014-09-17 パナソニック株式会社 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置
US9293390B2 (en) 2013-01-11 2016-03-22 Mitsubishi Electric Corporation Heat radiation structure for semiconductor device
JP6327549B2 (ja) * 2013-12-06 2018-05-23 ナガセケムテックス株式会社 熱硬化性樹脂組成物および熱伝導性シート
JP7119528B2 (ja) * 2018-04-18 2022-08-17 富士電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101649A (ja) * 1985-10-30 1987-05-12 Hitachi Chem Co Ltd 半導体封止用熱硬化性樹脂組成物

Also Published As

Publication number Publication date
JPH02166753A (ja) 1990-06-27

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