JPH0515744B2 - - Google Patents

Info

Publication number
JPH0515744B2
JPH0515744B2 JP63184246A JP18424688A JPH0515744B2 JP H0515744 B2 JPH0515744 B2 JP H0515744B2 JP 63184246 A JP63184246 A JP 63184246A JP 18424688 A JP18424688 A JP 18424688A JP H0515744 B2 JPH0515744 B2 JP H0515744B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
properties
silicon nitride
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63184246A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234657A (ja
Inventor
Yasuhiro Kyotani
Hideki Okabe
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP18424688A priority Critical patent/JPH0234657A/ja
Publication of JPH0234657A publication Critical patent/JPH0234657A/ja
Publication of JPH0515744B2 publication Critical patent/JPH0515744B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP18424688A 1988-07-22 1988-07-22 半導体封止用エポキシ樹脂組成物 Granted JPH0234657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18424688A JPH0234657A (ja) 1988-07-22 1988-07-22 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18424688A JPH0234657A (ja) 1988-07-22 1988-07-22 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH0234657A JPH0234657A (ja) 1990-02-05
JPH0515744B2 true JPH0515744B2 (enExample) 1993-03-02

Family

ID=16149944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18424688A Granted JPH0234657A (ja) 1988-07-22 1988-07-22 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPH0234657A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2579502Y2 (ja) * 1992-05-25 1998-08-27 株式会社村井 眼 鏡
EP0603928A1 (en) * 1992-12-21 1994-06-29 Delco Electronics Corporation Hybrid circuit
KR100540536B1 (ko) * 1998-12-31 2006-03-23 주식회사 케이씨씨 신뢰성이 향상된 반도체 봉지용 에폭시 수지조성물

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0657744B2 (ja) * 1985-03-27 1994-08-03 株式会社東芝 樹脂封止型半導体装置
JPS6250325A (ja) * 1985-08-29 1987-03-05 Hitachi Chem Co Ltd 電子部品封止用エポキシ成形材料
JPS62192447A (ja) * 1986-02-18 1987-08-24 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂成形材料
JPS62260818A (ja) * 1986-05-08 1987-11-13 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0234657A (ja) 1990-02-05

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