JPH0234657A - 半導体封止用エポキシ樹脂組成物 - Google Patents
半導体封止用エポキシ樹脂組成物Info
- Publication number
- JPH0234657A JPH0234657A JP18424688A JP18424688A JPH0234657A JP H0234657 A JPH0234657 A JP H0234657A JP 18424688 A JP18424688 A JP 18424688A JP 18424688 A JP18424688 A JP 18424688A JP H0234657 A JPH0234657 A JP H0234657A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- resin composition
- silicon nitride
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 38
- 239000000203 mixture Substances 0.000 title claims description 32
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000007789 sealing Methods 0.000 title description 11
- 239000000945 filler Substances 0.000 claims abstract description 28
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 22
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000003607 modifier Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 6
- 238000005538 encapsulation Methods 0.000 claims description 10
- 229920003986 novolac Polymers 0.000 claims description 10
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 15
- 239000005350 fused silica glass Substances 0.000 abstract description 6
- 229910002026 crystalline silica Inorganic materials 0.000 abstract description 5
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 5
- 239000011342 resin composition Substances 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000003921 oil Substances 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 230000035882 stress Effects 0.000 description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- -1 curing accelerators Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18424688A JPH0234657A (ja) | 1988-07-22 | 1988-07-22 | 半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18424688A JPH0234657A (ja) | 1988-07-22 | 1988-07-22 | 半導体封止用エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0234657A true JPH0234657A (ja) | 1990-02-05 |
| JPH0515744B2 JPH0515744B2 (enExample) | 1993-03-02 |
Family
ID=16149944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18424688A Granted JPH0234657A (ja) | 1988-07-22 | 1988-07-22 | 半導体封止用エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0234657A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0603928A1 (en) * | 1992-12-21 | 1994-06-29 | Delco Electronics Corporation | Hybrid circuit |
| US5663780A (en) * | 1992-05-25 | 1997-09-02 | Murai Co., Ltd. | Spectacles with decorative lens attaching device |
| KR100540536B1 (ko) * | 1998-12-31 | 2006-03-23 | 주식회사 케이씨씨 | 신뢰성이 향상된 반도체 봉지용 에폭시 수지조성물 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61221220A (ja) * | 1985-03-27 | 1986-10-01 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPS6250325A (ja) * | 1985-08-29 | 1987-03-05 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ成形材料 |
| JPS62192447A (ja) * | 1986-02-18 | 1987-08-24 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS62260818A (ja) * | 1986-05-08 | 1987-11-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
-
1988
- 1988-07-22 JP JP18424688A patent/JPH0234657A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61221220A (ja) * | 1985-03-27 | 1986-10-01 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPS6250325A (ja) * | 1985-08-29 | 1987-03-05 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ成形材料 |
| JPS62192447A (ja) * | 1986-02-18 | 1987-08-24 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS62260818A (ja) * | 1986-05-08 | 1987-11-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5663780A (en) * | 1992-05-25 | 1997-09-02 | Murai Co., Ltd. | Spectacles with decorative lens attaching device |
| EP0603928A1 (en) * | 1992-12-21 | 1994-06-29 | Delco Electronics Corporation | Hybrid circuit |
| KR100540536B1 (ko) * | 1998-12-31 | 2006-03-23 | 주식회사 케이씨씨 | 신뢰성이 향상된 반도체 봉지용 에폭시 수지조성물 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515744B2 (enExample) | 1993-03-02 |
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Legal Events
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