JPH02160998A - 電気絶縁積層板用原紙 - Google Patents

電気絶縁積層板用原紙

Info

Publication number
JPH02160998A
JPH02160998A JP31383288A JP31383288A JPH02160998A JP H02160998 A JPH02160998 A JP H02160998A JP 31383288 A JP31383288 A JP 31383288A JP 31383288 A JP31383288 A JP 31383288A JP H02160998 A JPH02160998 A JP H02160998A
Authority
JP
Japan
Prior art keywords
resin
base paper
paper
laminate
laminates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31383288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0457794B2 (en, 2012
Inventor
Kazutaka Nakagawa
一孝 中川
Yasutoku Nanri
泰徳 南里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Priority to JP31383288A priority Critical patent/JPH02160998A/ja
Publication of JPH02160998A publication Critical patent/JPH02160998A/ja
Publication of JPH0457794B2 publication Critical patent/JPH0457794B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Laminated Bodies (AREA)
  • Paper (AREA)
  • Organic Insulating Materials (AREA)
JP31383288A 1988-12-14 1988-12-14 電気絶縁積層板用原紙 Granted JPH02160998A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31383288A JPH02160998A (ja) 1988-12-14 1988-12-14 電気絶縁積層板用原紙

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31383288A JPH02160998A (ja) 1988-12-14 1988-12-14 電気絶縁積層板用原紙

Publications (2)

Publication Number Publication Date
JPH02160998A true JPH02160998A (ja) 1990-06-20
JPH0457794B2 JPH0457794B2 (en, 2012) 1992-09-14

Family

ID=18046047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31383288A Granted JPH02160998A (ja) 1988-12-14 1988-12-14 電気絶縁積層板用原紙

Country Status (1)

Country Link
JP (1) JPH02160998A (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5328566A (en) * 1991-01-22 1994-07-12 Honshu Paper Co., Ltd. Process for producing inorganic fiber-based prepreg sheet and process for producing insulating laminate
US5766386A (en) * 1995-09-07 1998-06-16 Hitachi Chemical Company, Ltd. Method of producing metal clad laminate
WO2012090908A1 (ja) * 2010-12-27 2012-07-05 王子製紙株式会社 微細繊維状セルロースコンポジットプリプレグシートの製造方法、微細繊維状セルロースコンポジットシートの製造方法及び微細繊維状セルロースコンポジット積層シートの製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119672A (en) * 1976-04-01 1977-10-07 Honshu Paper Co Ltd Manufacture of laminated plate and copperrclad laminated plate
JPS54147210A (en) * 1978-05-08 1979-11-17 Fuji Kakou Seishi Kk Phenolic resin containing paper and production
JPS54160479A (en) * 1978-06-08 1979-12-19 Mitsui Toatsu Chem Inc Manufacture of wood fibreboard
JPS58156100A (ja) * 1982-03-09 1983-09-16 日東紡績株式会社 高強度難燃性断熱ボ−ドの製造方法
JPS59112099A (ja) * 1982-12-15 1984-06-28 日本無機株式会社 ガラス紙の製造法
JPS61296199A (ja) * 1985-06-20 1986-12-26 山陽国策パルプ株式会社 電気絶縁積層板用原紙
JPS63211400A (ja) * 1987-02-24 1988-09-02 松下電工株式会社 積層板用紙基材

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119672A (en) * 1976-04-01 1977-10-07 Honshu Paper Co Ltd Manufacture of laminated plate and copperrclad laminated plate
JPS54147210A (en) * 1978-05-08 1979-11-17 Fuji Kakou Seishi Kk Phenolic resin containing paper and production
JPS54160479A (en) * 1978-06-08 1979-12-19 Mitsui Toatsu Chem Inc Manufacture of wood fibreboard
JPS58156100A (ja) * 1982-03-09 1983-09-16 日東紡績株式会社 高強度難燃性断熱ボ−ドの製造方法
JPS59112099A (ja) * 1982-12-15 1984-06-28 日本無機株式会社 ガラス紙の製造法
JPS61296199A (ja) * 1985-06-20 1986-12-26 山陽国策パルプ株式会社 電気絶縁積層板用原紙
JPS63211400A (ja) * 1987-02-24 1988-09-02 松下電工株式会社 積層板用紙基材

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5328566A (en) * 1991-01-22 1994-07-12 Honshu Paper Co., Ltd. Process for producing inorganic fiber-based prepreg sheet and process for producing insulating laminate
US5766386A (en) * 1995-09-07 1998-06-16 Hitachi Chemical Company, Ltd. Method of producing metal clad laminate
WO2012090908A1 (ja) * 2010-12-27 2012-07-05 王子製紙株式会社 微細繊維状セルロースコンポジットプリプレグシートの製造方法、微細繊維状セルロースコンポジットシートの製造方法及び微細繊維状セルロースコンポジット積層シートの製造方法
JP5644864B2 (ja) * 2010-12-27 2014-12-24 王子ホールディングス株式会社 微細繊維状セルロースコンポジットプリプレグシートの製造方法、微細繊維状セルロースコンポジットシートの製造方法及び微細繊維状セルロースコンポジット積層シートの製造方法
US8999088B2 (en) 2010-12-27 2015-04-07 Oji Holdings Corporation Process for production of finely fibrous cellulose composite prepreg sheet, process for production of finely fibrous cellulose composite sheet, and process for production of finely fibrous cellulose composite laminate sheet

Also Published As

Publication number Publication date
JPH0457794B2 (en, 2012) 1992-09-14

Similar Documents

Publication Publication Date Title
US4547408A (en) Metal-clad laminate adapted for printed circuits
JPH0145417B2 (en, 2012)
JP3011867B2 (ja) 積層板の製造方法
JPH02160998A (ja) 電気絶縁積層板用原紙
JPH04268340A (ja) 積層板およびその製造法
JPS60203642A (ja) コンポジツト積層板の製造法
JPS59166533A (ja) 寸法安定性の良好な熱硬化性樹脂積層板
JP3129652B2 (ja) 積層板の製造方法
JPS62151335A (ja) 積層板の製造方法
JPH09254331A (ja) 積層板
JPH02133437A (ja) 電気用積層板の製造方法
JPH0371459B2 (en, 2012)
JPH01146928A (ja) フェノール樹脂銅張積層板
JPH0721043B2 (ja) 積層板用樹脂組成物
JPS62254484A (ja) 高周波回路用誘電体基板の製造方法
JPH07112726B2 (ja) フェノ−ル樹脂銅張積層板
JPS62292428A (ja) 銅張積層板
JP3354346B2 (ja) 積層板の製造方法
JPS63172641A (ja) 銅張積層板
JPS61137733A (ja) 銅張積層板
JPH07100360B2 (ja) 銅張積層板
JPH04316836A (ja) 積層板の製造方法
JPS61246050A (ja) 積層板の製造法
JPH09227699A (ja) プリプレグの製造方法
JPH0497838A (ja) 銅張積層板