JPS52119672A - Manufacture of laminated plate and copperrclad laminated plate - Google Patents

Manufacture of laminated plate and copperrclad laminated plate

Info

Publication number
JPS52119672A
JPS52119672A JP3518376A JP3518376A JPS52119672A JP S52119672 A JPS52119672 A JP S52119672A JP 3518376 A JP3518376 A JP 3518376A JP 3518376 A JP3518376 A JP 3518376A JP S52119672 A JPS52119672 A JP S52119672A
Authority
JP
Japan
Prior art keywords
laminated plate
copperrclad
manufacture
laminated
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3518376A
Other languages
Japanese (ja)
Inventor
Susumu Nagai
Shinji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honshu Paper Co Ltd
Original Assignee
Honshu Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honshu Paper Co Ltd filed Critical Honshu Paper Co Ltd
Priority to JP3518376A priority Critical patent/JPS52119672A/en
Priority to DE19772714755 priority patent/DE2714755A1/en
Publication of JPS52119672A publication Critical patent/JPS52119672A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18—Paper- or board-based structures for surface covering
    • D21H27/22—Structures being applied on the surface by special manufacturing processes, e.g. in presses
    • D21H27/24—Structures being applied on the surface by special manufacturing processes, e.g. in presses characterised by the surface to be covered being phenolic-resin paper laminates, vulcan fibre or similar cellulosic fibreboards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP3518376A 1976-04-01 1976-04-01 Manufacture of laminated plate and copperrclad laminated plate Pending JPS52119672A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP3518376A JPS52119672A (en) 1976-04-01 1976-04-01 Manufacture of laminated plate and copperrclad laminated plate
DE19772714755 DE2714755A1 (en) 1976-04-01 1977-04-01 Thermosetting resin bonded laminates - made by adding resin dispersion to fibres on paper machine and laminating sheets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3518376A JPS52119672A (en) 1976-04-01 1976-04-01 Manufacture of laminated plate and copperrclad laminated plate

Publications (1)

Publication Number Publication Date
JPS52119672A true JPS52119672A (en) 1977-10-07

Family

ID=12434722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3518376A Pending JPS52119672A (en) 1976-04-01 1976-04-01 Manufacture of laminated plate and copperrclad laminated plate

Country Status (2)

Country Link
JP (1) JPS52119672A (en)
DE (1) DE2714755A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023431A (en) * 1988-06-15 1990-01-09 Sanyo Kokusaku Pulp Co Ltd Base paper for electrical insulating laminate
JPH02160998A (en) * 1988-12-14 1990-06-20 Sanyo Kokusaku Pulp Co Ltd Raw material for electrical insulation laminate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2493662A1 (en) * 1980-11-05 1982-05-07 Rhone Poulenc Ind METALLIZED SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023431A (en) * 1988-06-15 1990-01-09 Sanyo Kokusaku Pulp Co Ltd Base paper for electrical insulating laminate
JPH0371459B2 (en) * 1988-06-15 1991-11-13 Sanyo Kokusaku Pulp Co
JPH02160998A (en) * 1988-12-14 1990-06-20 Sanyo Kokusaku Pulp Co Ltd Raw material for electrical insulation laminate
JPH0457794B2 (en) * 1988-12-14 1992-09-14 Sanyo Kokusaku Pulp Co

Also Published As

Publication number Publication date
DE2714755A1 (en) 1977-10-06

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