JPH0215632B2 - - Google Patents

Info

Publication number
JPH0215632B2
JPH0215632B2 JP58145089A JP14508983A JPH0215632B2 JP H0215632 B2 JPH0215632 B2 JP H0215632B2 JP 58145089 A JP58145089 A JP 58145089A JP 14508983 A JP14508983 A JP 14508983A JP H0215632 B2 JPH0215632 B2 JP H0215632B2
Authority
JP
Japan
Prior art keywords
substrate
load lock
substrate holder
container
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58145089A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6039162A (ja
Inventor
Nobuyuki Takahashi
Hiroyoshi Murota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP14508983A priority Critical patent/JPS6039162A/ja
Publication of JPS6039162A publication Critical patent/JPS6039162A/ja
Publication of JPH0215632B2 publication Critical patent/JPH0215632B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
JP14508983A 1983-08-10 1983-08-10 薄膜処理真空装置 Granted JPS6039162A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14508983A JPS6039162A (ja) 1983-08-10 1983-08-10 薄膜処理真空装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14508983A JPS6039162A (ja) 1983-08-10 1983-08-10 薄膜処理真空装置

Publications (2)

Publication Number Publication Date
JPS6039162A JPS6039162A (ja) 1985-02-28
JPH0215632B2 true JPH0215632B2 (enrdf_load_html_response) 1990-04-12

Family

ID=15377122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14508983A Granted JPS6039162A (ja) 1983-08-10 1983-08-10 薄膜処理真空装置

Country Status (1)

Country Link
JP (1) JPS6039162A (enrdf_load_html_response)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105345B2 (ja) * 1985-08-08 1995-11-13 日電アネルバ株式会社 基体処理装置
US4647361A (en) * 1985-09-03 1987-03-03 International Business Machines Corporation Sputtering apparatus
JPH064587Y2 (ja) * 1987-01-29 1994-02-02 日電アネルバ株式会社 縦型バイアススパツタリング装置の基板ホルダ−
JPH0689442B2 (ja) * 1987-06-05 1994-11-09 新明和工業株式会社 真空蒸着装置
JPS6487768A (en) * 1987-09-29 1989-03-31 Hitachi Ltd Multifunction vacuum plating device
GB9405442D0 (en) * 1994-03-19 1994-05-04 Applied Vision Ltd Apparatus for coating substrates
GB0127251D0 (en) * 2001-11-13 2002-01-02 Nordiko Ltd Apparatus
JP2006233275A (ja) * 2005-02-24 2006-09-07 Japan Science & Technology Agency 薄膜形成装置
JP5026715B2 (ja) * 2006-03-17 2012-09-19 株式会社アルバック 金属とＳｉＯ２の混合膜の成膜方法
CN108368605B (zh) * 2015-12-17 2020-06-19 株式会社爱发科 真空处理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111482A (en) * 1975-03-26 1976-10-01 Hitachi Ltd Sample table for surface treatment apparatus

Also Published As

Publication number Publication date
JPS6039162A (ja) 1985-02-28

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