JPH02114980U - - Google Patents

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Publication number
JPH02114980U
JPH02114980U JP2456789U JP2456789U JPH02114980U JP H02114980 U JPH02114980 U JP H02114980U JP 2456789 U JP2456789 U JP 2456789U JP 2456789 U JP2456789 U JP 2456789U JP H02114980 U JPH02114980 U JP H02114980U
Authority
JP
Japan
Prior art keywords
resin
guide
electronic circuit
circuit device
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2456789U
Other languages
English (en)
Other versions
JPH0611536Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989024567U priority Critical patent/JPH0611536Y2/ja
Publication of JPH02114980U publication Critical patent/JPH02114980U/ja
Application granted granted Critical
Publication of JPH0611536Y2 publication Critical patent/JPH0611536Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は従来装置の部分断面構造図、第２図、
第３図は本考案の実施例を示す斜視構造図、及び
部分断面構造図、第４図はガイドの形状を示す部
分断面構造図であり、１は基板、２は部品、３は
リード、４は充填樹脂、５はケース、６はガイド
、Ａははい上り部である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 部品を実装した基板を箱状のケース内に収容し
    、樹脂により充填封止した樹脂封止型電子回路装
    置において、上方に導出するリードにガイドを貫
    通して固定し、該ガイドの外周部に充填樹脂のは
    い上り部を形成させたことを特徴とする樹脂封止
    型電子回路装置。
JP1989024567U 1989-03-03 1989-03-03 樹脂封止型電子回路装置 Expired - Lifetime JPH0611536Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989024567U JPH0611536Y2 (ja) 1989-03-03 1989-03-03 樹脂封止型電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989024567U JPH0611536Y2 (ja) 1989-03-03 1989-03-03 樹脂封止型電子回路装置

Publications (2)

Publication Number Publication Date
JPH02114980U true JPH02114980U (ja) 1990-09-14
JPH0611536Y2 JPH0611536Y2 (ja) 1994-03-23

Family

ID=31244522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989024567U Expired - Lifetime JPH0611536Y2 (ja) 1989-03-03 1989-03-03 樹脂封止型電子回路装置

Country Status (1)

Country Link
JP (1) JPH0611536Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605152U (ja) * 1983-06-24 1985-01-14 株式会社東芝 半導体モジユ−ル
JPS6216554A (ja) * 1985-07-15 1987-01-24 Sharp Corp 制御回路内蔵型電力半導体装置
EP0251260A1 (de) * 1986-07-01 1988-01-07 BROWN, BOVERI & CIE Aktiengesellschaft Leistungshalbleitermodul

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605152B2 (ja) * 1978-11-17 1985-02-08 松下電器産業株式会社 スイッチング回路

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605152U (ja) * 1983-06-24 1985-01-14 株式会社東芝 半導体モジユ−ル
JPS6216554A (ja) * 1985-07-15 1987-01-24 Sharp Corp 制御回路内蔵型電力半導体装置
EP0251260A1 (de) * 1986-07-01 1988-01-07 BROWN, BOVERI & CIE Aktiengesellschaft Leistungshalbleitermodul

Also Published As

Publication number Publication date
JPH0611536Y2 (ja) 1994-03-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term