JPH0379445U - - Google Patents

Info

Publication number
JPH0379445U
JPH0379445U JP14077889U JP14077889U JPH0379445U JP H0379445 U JPH0379445 U JP H0379445U JP 14077889 U JP14077889 U JP 14077889U JP 14077889 U JP14077889 U JP 14077889U JP H0379445 U JPH0379445 U JP H0379445U
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
hybrid integrated
partition
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14077889U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14077889U priority Critical patent/JPH0379445U/ja
Publication of JPH0379445U publication Critical patent/JPH0379445U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は従来のポツテイング封止型混成集積回
路構造図、第２図は本案の一実施例構造図である
。 １……容器、２……混成集積回路基板、３……
ポツテイング樹脂、４……背の高い部品、５……
リード線、６……樹脂の這上がり部分、７……背
の低い部品、８……筒状の仕切り、９……第１回
目のポツテイング樹脂面、１０……第２回目のポ
ツテイング樹脂面である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の電子部品を実装した混成集積回路基板を
    、容器内に収納し、樹脂により充填封止した構造
    の混成集積回路において、該基板上に実装した部
    品の内、最も背の高い部品を、筒型の仕切りで囲
    み、仕切り内の樹脂の高さが、仕切り外の樹脂の
    高さよりも高いことを特徴とする樹脂封止型混成
    集積回路。
JP14077889U 1989-12-05 1989-12-05 Pending JPH0379445U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14077889U JPH0379445U (ja) 1989-12-05 1989-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14077889U JPH0379445U (ja) 1989-12-05 1989-12-05

Publications (1)

Publication Number Publication Date
JPH0379445U true JPH0379445U (ja) 1991-08-13

Family

ID=31687723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14077889U Pending JPH0379445U (ja) 1989-12-05 1989-12-05

Country Status (1)

Country Link
JP (1) JPH0379445U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142431A (ja) * 2010-12-28 2012-07-26 Shindengen Electric Mfg Co Ltd 電子機器およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744691U (ja) * 1980-08-21 1982-03-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744691U (ja) * 1980-08-21 1982-03-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142431A (ja) * 2010-12-28 2012-07-26 Shindengen Electric Mfg Co Ltd 電子機器およびその製造方法

Similar Documents

Publication Publication Date Title
JPH0379445U (ja)
JPH02114980U (ja)
JPH0236045U (ja)
JPS594642U (ja) 混成集積回路基板封止体
JPS6416640U (ja)
JPH01179366U (ja)
JPH0379431U (ja)
JPS62138459U (ja)
JPS6364077U (ja)
JPH02122436U (ja)
JPS6218894U (ja)
JPH0348235U (ja)
JPS6336079U (ja)
JPS62172171U (ja)
JPH0231138U (ja)
JPS59111051U (ja) 混成集積回路装置
JPH0463148U (ja)
JPH02114940U (ja)
JPH0226816U (ja)
JPS61125054U (ja)
JPH0231149U (ja)
JPH0379444U (ja)
JPS59111052U (ja) 混成集積回路装置
JPS63162545U (ja)
JPS6452245U (ja)