JPS6452245U - - Google Patents
Info
- Publication number
- JPS6452245U JPS6452245U JP14702287U JP14702287U JPS6452245U JP S6452245 U JPS6452245 U JP S6452245U JP 14702287 U JP14702287 U JP 14702287U JP 14702287 U JP14702287 U JP 14702287U JP S6452245 U JPS6452245 U JP S6452245U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- sealing structure
- circuit board
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は従来の混成集積回路の封止構造の一例を示す
斜視図である。 １……混成集積回路基板、２……部品、３……
端子、４……金属ケース、５……封止用樹脂、６
……保持部材。
図は従来の混成集積回路の封止構造の一例を示す
斜視図である。 １……混成集積回路基板、２……部品、３……
端子、４……金属ケース、５……封止用樹脂、６
……保持部材。
Claims (1)
- 実装部品が搭載された混成集積回路基板を金属
ケース内に封止する混成集積回路の封止構造にお
いて、絶縁物の保持部材によつて前記混成集積回
路基板端の複数箇所を保持することを特徴とする
混成集積回路の封止構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14702287U JPS6452245U (ja) | 1987-09-25 | 1987-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14702287U JPS6452245U (ja) | 1987-09-25 | 1987-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6452245U true JPS6452245U (ja) | 1989-03-31 |
Family
ID=31417052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14702287U Pending JPS6452245U (ja) | 1987-09-25 | 1987-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6452245U (ja) |
-
1987
- 1987-09-25 JP JP14702287U patent/JPS6452245U/ja active Pending