JPH01170961U - - Google Patents
Info
- Publication number
- JPH01170961U JPH01170961U JP1988066702U JP6670288U JPH01170961U JP H01170961 U JPH01170961 U JP H01170961U JP 1988066702 U JP1988066702 U JP 1988066702U JP 6670288 U JP6670288 U JP 6670288U JP H01170961 U JPH01170961 U JP H01170961U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- terminal
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図ないし第３図は本考案に係る印刷基板の
端子構造の一実施例を示し、第１図は垂直断面組
立図、第２図は第１図における端子回りの分解斜
視図、第３図は第１図における端子の断面図であ
る。第４図は印刷基板の端子構造の従来例を示す
垂直断面組立図である。 １……印刷基板、１ａ……貫通穴、２……導電
回路、２ａ……導電端、３……端子、３ａ……差
込み端部、３ｂ……差込み折曲部、４……半用層
。
端子構造の一実施例を示し、第１図は垂直断面組
立図、第２図は第１図における端子回りの分解斜
視図、第３図は第１図における端子の断面図であ
る。第４図は印刷基板の端子構造の従来例を示す
垂直断面組立図である。 １……印刷基板、１ａ……貫通穴、２……導電
回路、２ａ……導電端、３……端子、３ａ……差
込み端部、３ｂ……差込み折曲部、４……半用層
。
Claims (1)
- 印刷基板上に導電回路を配設し、上記導電回路
の位置において上記印刷基板に貫通穴を形成し、
上記印刷基板を挾持する略コ字状の端子の挾持部
を上記貫通穴に臨ませ、上記貫通穴を介して半田
層により上記端子を印刷基板に固着したことを特
徴とする印刷基板の端子構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988066702U JPH055655Y2 (ja) | 1988-05-20 | 1988-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988066702U JPH055655Y2 (ja) | 1988-05-20 | 1988-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170961U true JPH01170961U (ja) | 1989-12-04 |
| JPH055655Y2 JPH055655Y2 (ja) | 1993-02-15 |
Family
ID=31292098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988066702U Expired - Lifetime JPH055655Y2 (ja) | 1988-05-20 | 1988-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH055655Y2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007060445A (ja) * | 2005-08-26 | 2007-03-08 | Hosiden Corp | 電気音響変換器の端子取り付け方法と構造並びに電気音響変換器 |
| WO2012096414A1 (en) * | 2011-01-13 | 2012-07-19 | Yazaki Corporation | Board connecting terminal and holding structure of circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01170961A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Graphic Commun Syst Inc | 光プリンタ |
-
1988
- 1988-05-20 JP JP1988066702U patent/JPH055655Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01170961A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Graphic Commun Syst Inc | 光プリンタ |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007060445A (ja) * | 2005-08-26 | 2007-03-08 | Hosiden Corp | 電気音響変換器の端子取り付け方法と構造並びに電気音響変換器 |
| WO2012096414A1 (en) * | 2011-01-13 | 2012-07-19 | Yazaki Corporation | Board connecting terminal and holding structure of circuit board |
| JP2012146564A (ja) * | 2011-01-13 | 2012-08-02 | Yazaki Corp | 基板接続用端子および回路基板の保持構造 |
| CN103380544A (zh) * | 2011-01-13 | 2013-10-30 | 矢崎总业株式会社 | 板连接端子和电路板的保持结构 |
| US8672718B2 (en) | 2011-01-13 | 2014-03-18 | Yazaki Corporation | Board connecting terminal and holding structure of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055655Y2 (ja) | 1993-02-15 |