JPH01156560U - - Google Patents
Info
- Publication number
- JPH01156560U JPH01156560U JP5498988U JP5498988U JPH01156560U JP H01156560 U JPH01156560 U JP H01156560U JP 5498988 U JP5498988 U JP 5498988U JP 5498988 U JP5498988 U JP 5498988U JP H01156560 U JPH01156560 U JP H01156560U
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- external lead
- fixed
- out terminal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａはこの考案の一実施例による半導体素
子を示す斜視図、第１図ｂは第１図ａのＡ―Ａ線
における断面図、第２図ａは従来の半導体素子の
斜視図、第２図ｂはＢ―Ｂ線における断面図であ
る。 図中、１は半導体素子、１ａは外部引出し端子
、１ｂは突起部、２はプリント基板、２ａは金属
膜、３は半田を示す。なお、図中、同一符号は同
一部分を示す。
子を示す斜視図、第１図ｂは第１図ａのＡ―Ａ線
における断面図、第２図ａは従来の半導体素子の
斜視図、第２図ｂはＢ―Ｂ線における断面図であ
る。 図中、１は半導体素子、１ａは外部引出し端子
、１ｂは突起部、２はプリント基板、２ａは金属
膜、３は半田を示す。なお、図中、同一符号は同
一部分を示す。
Claims (1)
- プリント基板上の金属膜上面に半田固着する外
部引出し端子を有する半導体素子において、上記
外部引出し端子は上記金属膜との固着面に突起部
を設けたことを特徴とする半導体素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5498988U JPH01156560U (ja) | 1988-04-21 | 1988-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5498988U JPH01156560U (ja) | 1988-04-21 | 1988-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156560U true JPH01156560U (ja) | 1989-10-27 |
Family
ID=31280897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5498988U Pending JPH01156560U (ja) | 1988-04-21 | 1988-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156560U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017188528A (ja) * | 2016-04-04 | 2017-10-12 | 三菱電機株式会社 | 半導体装置 |
-
1988
- 1988-04-21 JP JP5498988U patent/JPH01156560U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017188528A (ja) * | 2016-04-04 | 2017-10-12 | 三菱電機株式会社 | 半導体装置 |