JPH0231149U - - Google Patents
Info
- Publication number
- JPH0231149U JPH0231149U JP1988109037U JP10903788U JPH0231149U JP H0231149 U JPH0231149 U JP H0231149U JP 1988109037 U JP1988109037 U JP 1988109037U JP 10903788 U JP10903788 U JP 10903788U JP H0231149 U JPH0231149 U JP H0231149U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- synthetic resin
- circuit chip
- mounting structure
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図ａ，ｂ，ｃは実装手順を説明するための図、第
３図は従来の集積回路の実装構造を示す断面図で
ある。 １……集積回路チツプ、２……シーラーキヤツ
プ、３……電気部品、４……基板、５……ワイヤ
、６……リード線、２０……合成樹脂、２１……
プレート。
図ａ，ｂ，ｃは実装手順を説明するための図、第
３図は従来の集積回路の実装構造を示す断面図で
ある。 １……集積回路チツプ、２……シーラーキヤツ
プ、３……電気部品、４……基板、５……ワイヤ
、６……リード線、２０……合成樹脂、２１……
プレート。
Claims (1)
- 基板上に集積回路チツプを実装し、この集積回
路チツプを合成樹脂でモールドし、かつ前記合成
樹脂上に他の電気部品を実装するようにしたこと
を特徴とする集積回路の実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988109037U JPH0231149U (ja) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988109037U JPH0231149U (ja) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231149U true JPH0231149U (ja) | 1990-02-27 |
Family
ID=31344923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988109037U Pending JPH0231149U (ja) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231149U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6115357A (ja) * | 1984-07-02 | 1986-01-23 | Matsushita Electric Ind Co Ltd | 複合部品 |
-
1988
- 1988-08-22 JP JP1988109037U patent/JPH0231149U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6115357A (ja) * | 1984-07-02 | 1986-01-23 | Matsushita Electric Ind Co Ltd | 複合部品 |