JPH0281059U - - Google Patents

Info

Publication number
JPH0281059U
JPH0281059U JP16002188U JP16002188U JPH0281059U JP H0281059 U JPH0281059 U JP H0281059U JP 16002188 U JP16002188 U JP 16002188U JP 16002188 U JP16002188 U JP 16002188U JP H0281059 U JPH0281059 U JP H0281059U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
lead frame
resin
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16002188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16002188U priority Critical patent/JPH0281059U/ja
Publication of JPH0281059U publication Critical patent/JPH0281059U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の集積回路装置の実施例を示す
平面図、第２図は本考案の集積回路装置にコンデ
ンサを搭載した例を示す平面図、第３図は従来の
集積回路装置に示す平面図である。 １……リードフレーム、２……封止樹脂、３，
４……部品搭載リード、５……搭載部品（チツプ
コンデンサ）。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体集積回路を樹脂封止してなる集積回路装
    置において、該集積回路装置のリードフレームの
    一部が該樹脂封止領域外へ導出して形成され、該
    リードフレーム上に電子部品が搭載されているこ
    とを特徴とする集積回路装置。
JP16002188U 1988-12-09 1988-12-09 Pending JPH0281059U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16002188U JPH0281059U (ja) 1988-12-09 1988-12-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16002188U JPH0281059U (ja) 1988-12-09 1988-12-09

Publications (1)

Publication Number Publication Date
JPH0281059U true JPH0281059U (ja) 1990-06-22

Family

ID=31441728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16002188U Pending JPH0281059U (ja) 1988-12-09 1988-12-09

Country Status (1)

Country Link
JP (1) JPH0281059U (ja)

Similar Documents

Publication Publication Date Title
JPH0281059U (ja)
JPH028043U (ja)
JPS5818282U (ja) 発光ダイオ−ド表示装置
JPH0236045U (ja)
JPH01139450U (ja)
JPS63108648U (ja)
JPS62138459U (ja)
JPH02122436U (ja)
JPH01133745U (ja)
JPH0245676U (ja)
JPH0317636U (ja)
JPS63128745U (ja)
JPH01120356U (ja)
JPH0474458U (ja)
JPH0265355U (ja)
JPS62163956U (ja)
JPS6113943U (ja) 樹脂封止型半導体装置
JPH0231149U (ja)
JPH0336140U (ja)
JPH02125343U (ja)
JPS59111052U (ja) 混成集積回路装置
JPS60144242U (ja) 樹脂封止集積回路
JPH0415858U (ja)
JPH01104720U (ja)
JPH0247062U (ja)