JPS63137954U - - Google Patents
Info
- Publication number
- JPS63137954U JPS63137954U JP3139687U JP3139687U JPS63137954U JP S63137954 U JPS63137954 U JP S63137954U JP 3139687 U JP3139687 U JP 3139687U JP 3139687 U JP3139687 U JP 3139687U JP S63137954 U JPS63137954 U JP S63137954U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- groove
- external lead
- tip
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案実施例形状の要部破断斜視図、
第２図は同実施例電子部品の要部断面図、第３図
は従来の電子部品形状の要部破断斜視図である。 １……パツケージの樹脂封止部、２……外部リ
ード、３……溝、４……はんだ、５……実装基板
。
第２図は同実施例電子部品の要部断面図、第３図
は従来の電子部品形状の要部破断斜視図である。 １……パツケージの樹脂封止部、２……外部リ
ード、３……溝、４……はんだ、５……実装基板
。
Claims (1)
- パツケージ部から導出される外部リードの先端
部分に溝を形成したことを特徴とする電子部品。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3139687U JPS63137954U (ja) | 1987-03-04 | 1987-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3139687U JPS63137954U (ja) | 1987-03-04 | 1987-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137954U true JPS63137954U (ja) | 1988-09-12 |
Family
ID=30837085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3139687U Pending JPS63137954U (ja) | 1987-03-04 | 1987-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137954U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035947A (ja) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | はんだ付け部品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485376A (en) * | 1977-12-20 | 1979-07-06 | Mitsubishi Electric Corp | Method of producing composite ic circuit |
-
1987
- 1987-03-04 JP JP3139687U patent/JPS63137954U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485376A (en) * | 1977-12-20 | 1979-07-06 | Mitsubishi Electric Corp | Method of producing composite ic circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035947A (ja) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | はんだ付け部品 |