JPS62112144U - - Google Patents

Info

Publication number
JPS62112144U
JPS62112144U JP1985203659U JP20365985U JPS62112144U JP S62112144 U JPS62112144 U JP S62112144U JP 1985203659 U JP1985203659 U JP 1985203659U JP 20365985 U JP20365985 U JP 20365985U JP S62112144 U JPS62112144 U JP S62112144U
Authority
JP
Japan
Prior art keywords
circuit board
main body
bonding lead
board main
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985203659U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985203659U priority Critical patent/JPS62112144U/ja
Publication of JPS62112144U publication Critical patent/JPS62112144U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の回路基板の一部を省略した断
面図、第２図は部分拡大断面図、第３図は折曲段
部の他の実施例を示す一部省略断面図、第４図、
第５図は従来例を示す一部省略断面図である。 尚、図中、Ａ：回路基板、２：ＩＣチツプ、４
：ボンデイングリード、４ａ：折曲段部、６：マ
ウント部を夫々示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板本体のマウント部に突出するボンデイ
    ングリードに、ＩＣチツプを載置固定しよた回路
    基板において、該ボンデイングリードに前記回路
    基板本体の上面と所定の間隙をもつた折曲段部を
    形成したことを特徴とする回路基板。
JP1985203659U 1985-12-28 1985-12-28 Pending JPS62112144U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985203659U JPS62112144U (ja) 1985-12-28 1985-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985203659U JPS62112144U (ja) 1985-12-28 1985-12-28

Publications (1)

Publication Number Publication Date
JPS62112144U true JPS62112144U (ja) 1987-07-17

Family

ID=31169195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985203659U Pending JPS62112144U (ja) 1985-12-28 1985-12-28

Country Status (1)

Country Link
JP (1) JPS62112144U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311646A (ja) * 1989-06-08 1991-01-18 Shinko Electric Ind Co Ltd フィルムキャリア

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311646A (ja) * 1989-06-08 1991-01-18 Shinko Electric Ind Co Ltd フィルムキャリア

Similar Documents

Publication Publication Date Title
JPS62112144U (ja)
JPS60106370U (ja) 外部リ−ド端子の取付構造
JPH028043U (ja)
JPH0456374U (ja)
JPS6249271U (ja)
JPS6315033U (ja)
JPS63137954U (ja)
JPS63155698U (ja)
JPH01123358U (ja)
JPH0467350U (ja)
JPS62162848U (ja)
JPS62158860U (ja)
JPH0467372U (ja)
JPH0166763U (ja)
JPH0345U (ja)
JPH01137550U (ja)
JPH0195745U (ja)
JPH01117074U (ja)
JPH0213771U (ja)
JPS6090846U (ja) 混成集積回路
JPH0262738U (ja)
JPS63164239U (ja)
JPS62201941U (ja)
JPH01162273U (ja)
JPS6344450U (ja)