JPS62112144U - - Google Patents
Info
- Publication number
- JPS62112144U JPS62112144U JP1985203659U JP20365985U JPS62112144U JP S62112144 U JPS62112144 U JP S62112144U JP 1985203659 U JP1985203659 U JP 1985203659U JP 20365985 U JP20365985 U JP 20365985U JP S62112144 U JPS62112144 U JP S62112144U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- main body
- bonding lead
- board main
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第1図は本考案の回路基板の一部を省略した断
面図、第2図は部分拡大断面図、第3図は折曲段
部の他の実施例を示す一部省略断面図、第4図、
第5図は従来例を示す一部省略断面図である。 尚、図中、A:回路基板、2:ICチツプ、4
:ボンデイングリード、4a:折曲段部、6:マ
ウント部を夫々示す。
面図、第2図は部分拡大断面図、第3図は折曲段
部の他の実施例を示す一部省略断面図、第4図、
第5図は従来例を示す一部省略断面図である。 尚、図中、A:回路基板、2:ICチツプ、4
:ボンデイングリード、4a:折曲段部、6:マ
ウント部を夫々示す。
Claims (1)
- 回路基板本体のマウント部に突出するボンデイ
ングリードに、ICチツプを載置固定しよた回路
基板において、該ボンデイングリードに前記回路
基板本体の上面と所定の間隙をもつた折曲段部を
形成したことを特徴とする回路基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985203659U JPS62112144U (ja) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985203659U JPS62112144U (ja) | 1985-12-28 | 1985-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62112144U true JPS62112144U (ja) | 1987-07-17 |
Family
ID=31169195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985203659U Pending JPS62112144U (ja) | 1985-12-28 | 1985-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62112144U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0311646A (ja) * | 1989-06-08 | 1991-01-18 | Shinko Electric Ind Co Ltd | フィルムキャリア |
-
1985
- 1985-12-28 JP JP1985203659U patent/JPS62112144U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0311646A (ja) * | 1989-06-08 | 1991-01-18 | Shinko Electric Ind Co Ltd | フィルムキャリア |