JPH02104641U - - Google Patents

Info

Publication number
JPH02104641U
JPH02104641U JP1989012757U JP1275789U JPH02104641U JP H02104641 U JPH02104641 U JP H02104641U JP 1989012757 U JP1989012757 U JP 1989012757U JP 1275789 U JP1275789 U JP 1275789U JP H02104641 U JPH02104641 U JP H02104641U
Authority
JP
Japan
Prior art keywords
insulating board
composite
heat spreader
composite insulating
soldered onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989012757U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989012757U priority Critical patent/JPH02104641U/ja
Publication of JPH02104641U publication Critical patent/JPH02104641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の複合半導体装置の構造を示す
断面図、第２図は従来の複合半導体装置の構造を
示す断面図である。 １……導体ベース板、３……ヒートスプレツダ
、５……半導体ペレツト、７……外部端子、８…
…複合絶縁板、８ａ……絶縁基板、８ｂ……銅層
。 FIG. 1 is a cross-sectional view showing the structure of a composite semiconductor device of the present invention, and FIG. 2 is a cross-sectional view showing the structure of a conventional composite semiconductor device. DESCRIPTION OF SYMBOLS 1... Conductor base plate, 3... Heat spreader, 5... Semiconductor pellet, 7... External terminal, 8...
...Composite insulating board, 8a...Insulating substrate, 8b...Copper layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体ベース板上に半田固着させたヒートスプレ
ツダと、このヒートスプレツダ上に半田固着され
、絶縁基板の両表面に銅層を形成した複合絶縁板
と、この複合絶縁板上の銅層に直接半田固着させ
た半導体ペレツトを備えたことを特徴とする複合
半導体装置。 A heat spreader soldered onto a conductive base plate, a composite insulating board soldered onto the heat spreader with copper layers formed on both surfaces of the insulating board, and a composite insulating board directly attached to the copper layer on the composite insulating board. A composite semiconductor device characterized by comprising semiconductor pellets fixed with solder.
JP1989012757U 1989-02-06 1989-02-06 Pending JPH02104641U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989012757U JPH02104641U (en) 1989-02-06 1989-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989012757U JPH02104641U (en) 1989-02-06 1989-02-06

Publications (1)

Publication Number Publication Date
JPH02104641U true JPH02104641U (en) 1990-08-20

Family

ID=31222487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989012757U Pending JPH02104641U (en) 1989-02-06 1989-02-06

Country Status (1)

Country Link
JP (1) JPH02104641U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045399A (en) * 2009-11-17 2010-02-25 Mitsubishi Electric Corp Power semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218663B1 (en) * 1971-07-16 1977-05-23
JPS61240665A (en) * 1985-04-17 1986-10-25 Sanyo Electric Co Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218663B1 (en) * 1971-07-16 1977-05-23
JPS61240665A (en) * 1985-04-17 1986-10-25 Sanyo Electric Co Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045399A (en) * 2009-11-17 2010-02-25 Mitsubishi Electric Corp Power semiconductor device

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