JPH0385654U - - Google Patents
Info
- Publication number
- JPH0385654U JPH0385654U JP14681289U JP14681289U JPH0385654U JP H0385654 U JPH0385654 U JP H0385654U JP 14681289 U JP14681289 U JP 14681289U JP 14681289 U JP14681289 U JP 14681289U JP H0385654 U JPH0385654 U JP H0385654U
- Authority
- JP
- Japan
- Prior art keywords
- tab terminal
- plate
- copper foil
- upward step
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は本考案実施例を示し、第１
図は、要部切欠拡大縦断面図、第２図は、基板部
の斜視図、第３図乃至第５図は従来例を示し、第
３図は、一部切欠拡大縦断面図、第４図は、基板
部の斜視図、第５図ａ、第５図ｂ、第５図ｃ、第
５図ｄは、それぞれ取付状態の異なる場合を模式
的に示す部分切欠側面図である。
１……絶縁基板、２……銅箔（板）、２′……
上向き段部、１０……タブ端子、１１……半田。
1 and 2 show an embodiment of the present invention, and the first
2 is a perspective view of the base plate, FIGS. 3 to 5 show a conventional example, FIG. 3 is an enlarged longitudinal sectional view of a part cut away, and FIG. 5A, 5B, 5C, and 5D are partially cutaway side views schematically showing different mounting states, respectively. 1...Insulating board, 2...Copper foil (plate), 2'...
Upward step, 10...Tab terminal, 11...Solder.
Claims (1)
、上向き段部を形成した銅箔（板）を定着すると
共に、該上向き段部と前記基板とのなす間隙にタ
ブ端子の基端部を挿入して該銅箔（板）とタブ端
子との間を半田によつて固着したことを特徴とす
る電力用半導体のタブ端子取付構造。 A copper foil (plate) with an upward step formed thereon is fixed onto an insulating substrate with good thermal conductivity such as ceramic, and the base end of the tab terminal is inserted into the gap formed between the upward step and the substrate. A tab terminal mounting structure for a power semiconductor, characterized in that the copper foil (plate) and the tab terminal are fixed by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14681289U JPH0385654U (en) | 1989-12-19 | 1989-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14681289U JPH0385654U (en) | 1989-12-19 | 1989-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385654U true JPH0385654U (en) | 1991-08-29 |
Family
ID=31693356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14681289U Pending JPH0385654U (en) | 1989-12-19 | 1989-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385654U (en) |
-
1989
- 1989-12-19 JP JP14681289U patent/JPH0385654U/ja active Pending