JPH0193441U - - Google Patents
Info
- Publication number
- JPH0193441U JPH0193441U JP1987189721U JP18972187U JPH0193441U JP H0193441 U JPH0193441 U JP H0193441U JP 1987189721 U JP1987189721 U JP 1987189721U JP 18972187 U JP18972187 U JP 18972187U JP H0193441 U JPH0193441 U JP H0193441U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- led array
- optical printer
- main surface
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第1図は本考案による光プリンタ用LEDアレ
イの平面図。第2図は本考案による光プリンタ用
LEDアレイの断面を示す断面図。第3図a〜g
は本考案による光プリンタ用LEDアレイの略製
造工程を示す工程図。第4図は従来のLEDアレ
イの平面図。第5図は従来のLEDアレイの断面
図。第6図a〜iは従来のLEDアレイの略製造
工程を示す工程図。 1……n型GaPウエハー、2……n型GaP
層、3……p型GaP層、5……p側金属薄膜、
6……n側金属薄膜、7……発光領域、8……分
離溝、11……n型GaAsPウエハー、12…
…n型GaAsP層、13……p型GaAsP層
、14……Si3N4薄膜、15……p側金属薄
膜、16……n側金属薄膜、17……発光領域。
イの平面図。第2図は本考案による光プリンタ用
LEDアレイの断面を示す断面図。第3図a〜g
は本考案による光プリンタ用LEDアレイの略製
造工程を示す工程図。第4図は従来のLEDアレ
イの平面図。第5図は従来のLEDアレイの断面
図。第6図a〜iは従来のLEDアレイの略製造
工程を示す工程図。 1……n型GaPウエハー、2……n型GaP
層、3……p型GaP層、5……p側金属薄膜、
6……n側金属薄膜、7……発光領域、8……分
離溝、11……n型GaAsPウエハー、12…
…n型GaAsP層、13……p型GaAsP層
、14……Si3N4薄膜、15……p側金属薄
膜、16……n側金属薄膜、17……発光領域。
Claims (1)
- 主面上に整列して設けられた発光領域を有した
印字に使用される光プリンタ用発光ダイオードア
レイ(以下、LEDアレイ)において、LEDア
レイが、該主面上に複数の発光領域が千鳥状に整
列配置され、前記発光領域の分離が少なくともp
―n接合部を切断する分離溝を設けられて成る、
メサモノリシツク型LEDアレイであることを特
徴とする光プリンタ用発光ダイオードアレイ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987189721U JPH0193441U (ja) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987189721U JPH0193441U (ja) | 1987-12-14 | 1987-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0193441U true JPH0193441U (ja) | 1989-06-20 |
Family
ID=31480736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987189721U Pending JPH0193441U (ja) | 1987-12-14 | 1987-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0193441U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015111265A (ja) * | 2009-05-14 | 2015-06-18 | 4233999 カナダ,インコーポレーテッド | 発光ダイオードのモノリシックアレイを使用して高解像度イメージを提供するシステムおよび方法 |
-
1987
- 1987-12-14 JP JP1987189721U patent/JPH0193441U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015111265A (ja) * | 2009-05-14 | 2015-06-18 | 4233999 カナダ,インコーポレーテッド | 発光ダイオードのモノリシックアレイを使用して高解像度イメージを提供するシステムおよび方法 |
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