JPH0159290B2 - - Google Patents
Info
- Publication number
- JPH0159290B2 JPH0159290B2 JP17609984A JP17609984A JPH0159290B2 JP H0159290 B2 JPH0159290 B2 JP H0159290B2 JP 17609984 A JP17609984 A JP 17609984A JP 17609984 A JP17609984 A JP 17609984A JP H0159290 B2 JPH0159290 B2 JP H0159290B2
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- prepreg
- water
- resin
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 18
- 229920001568 phenolic resin Polymers 0.000 claims description 14
- 239000005011 phenolic resin Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 238000013508 migration Methods 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 239000000123 paper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- 229920002866 paraformaldehyde Polymers 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical class O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17609984A JPS6155124A (ja) | 1984-08-24 | 1984-08-24 | 積層板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17609984A JPS6155124A (ja) | 1984-08-24 | 1984-08-24 | 積層板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6155124A JPS6155124A (ja) | 1986-03-19 |
JPH0159290B2 true JPH0159290B2 (US07943777-20110517-C00090.png) | 1989-12-15 |
Family
ID=16007676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17609984A Granted JPS6155124A (ja) | 1984-08-24 | 1984-08-24 | 積層板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6155124A (US07943777-20110517-C00090.png) |
-
1984
- 1984-08-24 JP JP17609984A patent/JPS6155124A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6155124A (ja) | 1986-03-19 |
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