JPH0158866B2 - - Google Patents

Info

Publication number
JPH0158866B2
JPH0158866B2 JP58239234A JP23923483A JPH0158866B2 JP H0158866 B2 JPH0158866 B2 JP H0158866B2 JP 58239234 A JP58239234 A JP 58239234A JP 23923483 A JP23923483 A JP 23923483A JP H0158866 B2 JPH0158866 B2 JP H0158866B2
Authority
JP
Japan
Prior art keywords
semiconductor element
bonding
temperature
film lead
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58239234A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60130837A (ja
Inventor
Kenzo Hatada
Minoru Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58239234A priority Critical patent/JPS60130837A/ja
Publication of JPS60130837A publication Critical patent/JPS60130837A/ja
Publication of JPH0158866B2 publication Critical patent/JPH0158866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58239234A 1983-12-19 1983-12-19 半導体装置の製造方法 Granted JPS60130837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58239234A JPS60130837A (ja) 1983-12-19 1983-12-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58239234A JPS60130837A (ja) 1983-12-19 1983-12-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60130837A JPS60130837A (ja) 1985-07-12
JPH0158866B2 true JPH0158866B2 (cs) 1989-12-13

Family

ID=17041738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58239234A Granted JPS60130837A (ja) 1983-12-19 1983-12-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60130837A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666361B2 (ja) * 1985-10-23 1994-08-24 松下電器産業株式会社 ボンディング装置及びボンディング方法
US4876221A (en) * 1988-05-03 1989-10-24 Matsushita Electric Industrial Co., Ltd. Bonding method
JP2591600B2 (ja) * 1995-08-07 1997-03-19 松下電器産業株式会社 ボンディング方法
KR102732411B1 (ko) * 2019-06-14 2024-11-20 삼성디스플레이 주식회사 표시 장치의 제조 장치, 및 표시 장치의 제조 방법

Also Published As

Publication number Publication date
JPS60130837A (ja) 1985-07-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term