JPH0155604B2 - - Google Patents
Info
- Publication number
- JPH0155604B2 JPH0155604B2 JP57021461A JP2146182A JPH0155604B2 JP H0155604 B2 JPH0155604 B2 JP H0155604B2 JP 57021461 A JP57021461 A JP 57021461A JP 2146182 A JP2146182 A JP 2146182A JP H0155604 B2 JPH0155604 B2 JP H0155604B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- electrode
- electrodes
- insulator
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 56
- 239000012212 insulator Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000605 extraction Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000010897 surface acoustic wave method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 230000005284 excitation Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2146182A JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2146182A JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Related Child Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7952782A Division JPS58139513A (ja) | 1982-05-11 | 1982-05-11 | チップ状圧電振動部品の製造方法 |
JP8446282A Division JPS58139514A (ja) | 1982-05-18 | 1982-05-18 | チップ状圧電振動部品の製造方法 |
JP8630182A Division JPS58139511A (ja) | 1982-05-20 | 1982-05-20 | チツプ状圧電振動部品の製造方法 |
JP8692282A Division JPS58139515A (ja) | 1982-05-21 | 1982-05-21 | チップ状圧電振動部品の製造方法 |
JP8868182A Division JPS58139516A (ja) | 1982-05-24 | 1982-05-24 | チツプ状圧電振動部品 |
JP8868282A Division JPS58139517A (ja) | 1982-05-24 | 1982-05-24 | チツプ状圧電振動部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58138115A JPS58138115A (ja) | 1983-08-16 |
JPH0155604B2 true JPH0155604B2 (US07943777-20110517-C00090.png) | 1989-11-27 |
Family
ID=12055613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2146182A Granted JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58138115A (US07943777-20110517-C00090.png) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58205319A (ja) * | 1982-05-25 | 1983-11-30 | Citizen Watch Co Ltd | 弾性表面波装置 |
JPS6196812A (ja) * | 1984-10-17 | 1986-05-15 | Murata Mfg Co Ltd | 電子部品 |
FR2579829B1 (fr) * | 1985-03-29 | 1988-06-24 | Thomson Csf | Procede de fabrication de dispositifs a ondes de surface |
JPS62109420A (ja) * | 1985-11-07 | 1987-05-20 | Alps Electric Co Ltd | 弾性表面波素子 |
JPS62173813A (ja) * | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | 弾性表面波素子 |
CA1273701A (en) * | 1986-03-12 | 1990-09-04 | Mark S. Suthers | Saw device with apodized idt |
JPH01142215U (US07943777-20110517-C00090.png) * | 1988-03-23 | 1989-09-29 | ||
JPH07303022A (ja) * | 1994-05-09 | 1995-11-14 | Murata Mfg Co Ltd | 弾性表面波装置 |
JPH11112280A (ja) * | 1997-10-03 | 1999-04-23 | Murata Mfg Co Ltd | 電子部品およびラダーフィルタ |
JP3514361B2 (ja) * | 1998-02-27 | 2004-03-31 | Tdk株式会社 | チップ素子及びチップ素子の製造方法 |
JP2007180995A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Kinseki Corp | 圧電振動子 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472696A (en) * | 1977-11-21 | 1979-06-11 | Citizen Watch Co Ltd | Package for super miniature size piezoelectric oscillator |
JPS5661820A (en) * | 1979-10-25 | 1981-05-27 | Matsushima Kogyo Co Ltd | Quartz oscillator |
JPS5717124A (en) * | 1980-07-05 | 1982-01-28 | Tdk Electronics Co Ltd | Capacitor and method of producing same |
-
1982
- 1982-02-12 JP JP2146182A patent/JPS58138115A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472696A (en) * | 1977-11-21 | 1979-06-11 | Citizen Watch Co Ltd | Package for super miniature size piezoelectric oscillator |
JPS5661820A (en) * | 1979-10-25 | 1981-05-27 | Matsushima Kogyo Co Ltd | Quartz oscillator |
JPS5717124A (en) * | 1980-07-05 | 1982-01-28 | Tdk Electronics Co Ltd | Capacitor and method of producing same |
Also Published As
Publication number | Publication date |
---|---|
JPS58138115A (ja) | 1983-08-16 |