JPH0151055B2 - - Google Patents

Info

Publication number
JPH0151055B2
JPH0151055B2 JP59158847A JP15884784A JPH0151055B2 JP H0151055 B2 JPH0151055 B2 JP H0151055B2 JP 59158847 A JP59158847 A JP 59158847A JP 15884784 A JP15884784 A JP 15884784A JP H0151055 B2 JPH0151055 B2 JP H0151055B2
Authority
JP
Japan
Prior art keywords
die
tape
bonding
lead
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59158847A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60121733A (ja
Inventor
Yasunobu Suzuki
Seiichi Chiba
Akihiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP15884784A priority Critical patent/JPS60121733A/ja
Publication of JPS60121733A publication Critical patent/JPS60121733A/ja
Publication of JPH0151055B2 publication Critical patent/JPH0151055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP15884784A 1984-07-31 1984-07-31 インナ−リ−ドボンダ− Granted JPS60121733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15884784A JPS60121733A (ja) 1984-07-31 1984-07-31 インナ−リ−ドボンダ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15884784A JPS60121733A (ja) 1984-07-31 1984-07-31 インナ−リ−ドボンダ−

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP58035584A Division JPS59161040A (ja) 1983-03-03 1983-03-03 インナ−リ−ドボンダ−

Publications (2)

Publication Number Publication Date
JPS60121733A JPS60121733A (ja) 1985-06-29
JPH0151055B2 true JPH0151055B2 (enrdf_load_stackoverflow) 1989-11-01

Family

ID=15680702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15884784A Granted JPS60121733A (ja) 1984-07-31 1984-07-31 インナ−リ−ドボンダ−

Country Status (1)

Country Link
JP (1) JPS60121733A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2775553B2 (ja) * 1992-07-15 1998-07-16 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
KR100451760B1 (ko) * 1998-12-29 2004-12-17 주식회사 하이닉스반도체 테이프캐리어패키지제조공정용인너리드본딩장치의구조

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1109635A (en) * 1977-05-23 1981-09-29 Armand Mamourian Purifying and defluorinating impure phosphoric acid
JPS5827657B2 (ja) * 1978-04-12 1983-06-10 株式会社日立製作所 テ−プキヤリア方式のボンデイング方法及びその装置
JPS571235A (en) * 1980-06-04 1982-01-06 Hitachi Ltd Method for pellet bonding and manufacture thereof
JPS5753950A (ja) * 1980-09-17 1982-03-31 Fujitsu Ltd Peretsutobondeingusochi
JPS57147245A (en) * 1981-03-05 1982-09-11 Shinkawa Ltd Positioning method and device for chip bonding
JPS58141A (ja) * 1981-06-25 1983-01-05 Shinkawa Ltd 自動インナ−リ−ドボンデイング方法

Also Published As

Publication number Publication date
JPS60121733A (ja) 1985-06-29

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