JPH023543B2 - - Google Patents

Info

Publication number
JPH023543B2
JPH023543B2 JP59091377A JP9137784A JPH023543B2 JP H023543 B2 JPH023543 B2 JP H023543B2 JP 59091377 A JP59091377 A JP 59091377A JP 9137784 A JP9137784 A JP 9137784A JP H023543 B2 JPH023543 B2 JP H023543B2
Authority
JP
Japan
Prior art keywords
die
carrier tape
wafer
bonding
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59091377A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60234336A (ja
Inventor
Yasunobu Suzuki
Akio Bando
Seiichi Chiba
Akihiro Nishimura
Hisao Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP59091377A priority Critical patent/JPS60234336A/ja
Publication of JPS60234336A publication Critical patent/JPS60234336A/ja
Publication of JPH023543B2 publication Critical patent/JPH023543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59091377A 1984-05-07 1984-05-07 インナ−リ−ドボンダ− Granted JPS60234336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59091377A JPS60234336A (ja) 1984-05-07 1984-05-07 インナ−リ−ドボンダ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59091377A JPS60234336A (ja) 1984-05-07 1984-05-07 インナ−リ−ドボンダ−

Publications (2)

Publication Number Publication Date
JPS60234336A JPS60234336A (ja) 1985-11-21
JPH023543B2 true JPH023543B2 (enrdf_load_stackoverflow) 1990-01-24

Family

ID=14024678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59091377A Granted JPS60234336A (ja) 1984-05-07 1984-05-07 インナ−リ−ドボンダ−

Country Status (1)

Country Link
JP (1) JPS60234336A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS60234336A (ja) 1985-11-21

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