JPH0143458B2 - - Google Patents
Info
- Publication number
- JPH0143458B2 JPH0143458B2 JP56049265A JP4926581A JPH0143458B2 JP H0143458 B2 JPH0143458 B2 JP H0143458B2 JP 56049265 A JP56049265 A JP 56049265A JP 4926581 A JP4926581 A JP 4926581A JP H0143458 B2 JPH0143458 B2 JP H0143458B2
- Authority
- JP
- Japan
- Prior art keywords
- grid line
- semiconductor
- semiconductor substrate
- semiconductor device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4926581A JPS57164546A (en) | 1981-04-03 | 1981-04-03 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4926581A JPS57164546A (en) | 1981-04-03 | 1981-04-03 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57164546A JPS57164546A (en) | 1982-10-09 |
| JPH0143458B2 true JPH0143458B2 (enrdf_load_stackoverflow) | 1989-09-20 |
Family
ID=12825992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4926581A Granted JPS57164546A (en) | 1981-04-03 | 1981-04-03 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57164546A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59121851A (ja) * | 1982-12-28 | 1984-07-14 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPS6255941A (ja) * | 1985-09-05 | 1987-03-11 | Matsushita Electronics Corp | 半導体装置の製造方法 |
| JPH02308551A (ja) * | 1989-05-23 | 1990-12-21 | Nec Corp | 半導体ウェーハ |
| JPH0622991Y2 (ja) * | 1990-02-28 | 1994-06-15 | 沖電気工業株式会社 | 化合物半導体ウエハ |
| JP2012204568A (ja) * | 2011-03-25 | 2012-10-22 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS557019B2 (enrdf_load_stackoverflow) * | 1972-05-10 | 1980-02-21 | ||
| JPS605060B2 (ja) * | 1976-04-06 | 1985-02-08 | 株式会社東芝 | 半導体集積回路装置 |
| JPS5457957A (en) * | 1977-10-18 | 1979-05-10 | Mitsubishi Electric Corp | Production of semiconductor device |
-
1981
- 1981-04-03 JP JP4926581A patent/JPS57164546A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57164546A (en) | 1982-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0039174B1 (en) | Gold metallisation in semiconductor devices | |
| JPH0143458B2 (enrdf_load_stackoverflow) | ||
| JPS6364057B2 (enrdf_load_stackoverflow) | ||
| JP2000150518A (ja) | 半導体装置の製造方法 | |
| JPH0342505B2 (enrdf_load_stackoverflow) | ||
| JPS6329940A (ja) | 半導体装置の製造方法 | |
| JPH03198342A (ja) | 半導体装置の製造方法 | |
| JPH0482054B2 (enrdf_load_stackoverflow) | ||
| JPS60176231A (ja) | 化合物半導体素子の電極の形成方法 | |
| KR100224588B1 (ko) | 반도체 소자의 본딩 패드 형성방법 | |
| KR100876286B1 (ko) | 반도체 소자 및 그 제조 방법 | |
| KR0137813B1 (ko) | 모스 트랜지스터(mosfet)의 금속 배선 형성 방법 | |
| KR100207285B1 (ko) | 반도체 소자의 본딩패드 형성방법 | |
| JP3031689B2 (ja) | 半導体集積回路装置およびその製造方法 | |
| JPS5950221B2 (ja) | 半導体装置の製造方法 | |
| JPH0831710A (ja) | 半導体装置の製造方法 | |
| JPS6167225A (ja) | パタ−ン形成方法 | |
| JPH08107112A (ja) | 半導体装置の配線形成方法 | |
| JPH0567620A (ja) | バンプ形成方法 | |
| JPS6325954A (ja) | 半導体装置およびその製造方法 | |
| JPH0822966A (ja) | 半導体装置及びその製造方法 | |
| JPS6362103B2 (enrdf_load_stackoverflow) | ||
| JPS5815253A (ja) | 半導体装置の電極製造方法 | |
| JPH05114537A (ja) | 半導体集積回路の製造方法 | |
| JPS60219772A (ja) | 半導体装置の製造方法 |