JPH0342505B2 - - Google Patents
Info
- Publication number
- JPH0342505B2 JPH0342505B2 JP57227297A JP22729782A JPH0342505B2 JP H0342505 B2 JPH0342505 B2 JP H0342505B2 JP 57227297 A JP57227297 A JP 57227297A JP 22729782 A JP22729782 A JP 22729782A JP H0342505 B2 JPH0342505 B2 JP H0342505B2
- Authority
- JP
- Japan
- Prior art keywords
- grid line
- oxide film
- semiconductor device
- silicide layer
- platinum silicide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57227297A JPS59121851A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57227297A JPS59121851A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59121851A JPS59121851A (ja) | 1984-07-14 |
| JPH0342505B2 true JPH0342505B2 (enrdf_load_stackoverflow) | 1991-06-27 |
Family
ID=16858602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57227297A Granted JPS59121851A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121851A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2777426B2 (ja) * | 1989-10-16 | 1998-07-16 | 三洋電機株式会社 | 半導体装置の製造方法 |
| JPH0438053U (enrdf_load_stackoverflow) * | 1990-07-26 | 1992-03-31 | ||
| JP5173525B2 (ja) * | 2008-03-28 | 2013-04-03 | ルネサスエレクトロニクス株式会社 | 半導体ウエハ、半導体チップ、半導体装置、及び半導体装置の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5779646A (en) * | 1980-11-05 | 1982-05-18 | Nec Corp | Semiconductor wafer |
| JPS57164546A (en) * | 1981-04-03 | 1982-10-09 | Oki Electric Ind Co Ltd | Semiconductor device |
-
1982
- 1982-12-28 JP JP57227297A patent/JPS59121851A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59121851A (ja) | 1984-07-14 |
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