JPS5779646A - Semiconductor wafer - Google Patents

Semiconductor wafer

Info

Publication number
JPS5779646A
JPS5779646A JP15533480A JP15533480A JPS5779646A JP S5779646 A JPS5779646 A JP S5779646A JP 15533480 A JP15533480 A JP 15533480A JP 15533480 A JP15533480 A JP 15533480A JP S5779646 A JPS5779646 A JP S5779646A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
positioning
scriber
hairline
breadth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15533480A
Other languages
Japanese (ja)
Inventor
Akiyuki Motoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15533480A priority Critical patent/JPS5779646A/en
Publication of JPS5779646A publication Critical patent/JPS5779646A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To enable to facilitate positioning of a semiconductor wafer with a hairline of scriber by a method wherein line patterns having the prescribed breadth and being recognizable to be discriminated optically from the circumferential material are provided at the center parts of the cutting off regions of the semiconductor wafer. CONSTITUTION:After Al is adhered on an Si substrate 1 interposing an Si oxide film 2 between them, it is converted into an alumina film 3 excepting the parts to constitute conductive paths, and when it is to be divided into elements next, the pattern lines 5 having breadth of 10mum or less being possible to be discriminated optically from the circumferential material of Al, etc., is provided at the center parts of the cutting regions 4. Accordingly positioning with the hairline of scriber is simplified, and precision of positioning is also enhanced.
JP15533480A 1980-11-05 1980-11-05 Semiconductor wafer Pending JPS5779646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15533480A JPS5779646A (en) 1980-11-05 1980-11-05 Semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15533480A JPS5779646A (en) 1980-11-05 1980-11-05 Semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5779646A true JPS5779646A (en) 1982-05-18

Family

ID=15603614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15533480A Pending JPS5779646A (en) 1980-11-05 1980-11-05 Semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5779646A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121851A (en) * 1982-12-28 1984-07-14 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS6151845A (en) * 1984-08-21 1986-03-14 Matsushita Electronics Corp Dicing of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121851A (en) * 1982-12-28 1984-07-14 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPH0342505B2 (en) * 1982-12-28 1991-06-27
JPS6151845A (en) * 1984-08-21 1986-03-14 Matsushita Electronics Corp Dicing of semiconductor device

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