JPS5651839A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5651839A
JPS5651839A JP12918879A JP12918879A JPS5651839A JP S5651839 A JPS5651839 A JP S5651839A JP 12918879 A JP12918879 A JP 12918879A JP 12918879 A JP12918879 A JP 12918879A JP S5651839 A JPS5651839 A JP S5651839A
Authority
JP
Japan
Prior art keywords
patterns
semiconductor element
bonding
mounting
indexing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12918879A
Other languages
Japanese (ja)
Other versions
JPS6327856B2 (en
Inventor
Kazufumi Terachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12918879A priority Critical patent/JPS5651839A/en
Publication of JPS5651839A publication Critical patent/JPS5651839A/en
Publication of JPS6327856B2 publication Critical patent/JPS6327856B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To permit an accurate positioning in mounting a large-sized or lean and long semiconductor element by providing indexing patterns for the semiconductor element and the element bonding part. CONSTITUTION:An indexing pattern 209 is provided on a portion of the surface of an element bonding partion 203', and another indexing pattern 210 is provided on a semiconductor element 202'. Then these patterns 209 and 210 are aligned and secured. This permits the element 202' to be accurately mounted on the bonding portion 203'. Moreover, the patterns can be diverted to the position discrimination purpose as they are when the mounting is made automatic.
JP12918879A 1979-10-05 1979-10-05 Semiconductor device Granted JPS5651839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12918879A JPS5651839A (en) 1979-10-05 1979-10-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12918879A JPS5651839A (en) 1979-10-05 1979-10-05 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5651839A true JPS5651839A (en) 1981-05-09
JPS6327856B2 JPS6327856B2 (en) 1988-06-06

Family

ID=15003310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12918879A Granted JPS5651839A (en) 1979-10-05 1979-10-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5651839A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192029A (en) * 1981-05-20 1982-11-26 Matsushita Electric Ind Co Ltd Mask set and positioning method for mask
JPS59115645U (en) * 1983-01-24 1984-08-04 日本電気株式会社 Stem for semiconductor devices
JPS607120A (en) * 1983-06-25 1985-01-14 Rohm Co Ltd Method for positioning semiconductor wafer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52138873A (en) * 1976-05-14 1977-11-19 Nec Corp Automatic positioning method of semiconductor pellets

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52138873A (en) * 1976-05-14 1977-11-19 Nec Corp Automatic positioning method of semiconductor pellets

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192029A (en) * 1981-05-20 1982-11-26 Matsushita Electric Ind Co Ltd Mask set and positioning method for mask
JPS59115645U (en) * 1983-01-24 1984-08-04 日本電気株式会社 Stem for semiconductor devices
JPS607120A (en) * 1983-06-25 1985-01-14 Rohm Co Ltd Method for positioning semiconductor wafer

Also Published As

Publication number Publication date
JPS6327856B2 (en) 1988-06-06

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