JPS57189736A - Matching method - Google Patents
Matching methodInfo
- Publication number
- JPS57189736A JPS57189736A JP56073765A JP7376581A JPS57189736A JP S57189736 A JPS57189736 A JP S57189736A JP 56073765 A JP56073765 A JP 56073765A JP 7376581 A JP7376581 A JP 7376581A JP S57189736 A JPS57189736 A JP S57189736A
- Authority
- JP
- Japan
- Prior art keywords
- mark
- positioning
- matched
- detector elements
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 abstract 4
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
PURPOSE:To enable a printing substrate or the like to be accurately located irrespective of change in efficiency of reflection or the like of a mark by constituting a pair of the printing substrate or the like and a detector element of a matching unit for detecting and positioning the detecting mark at a predetermined position. CONSTITUTION:A body 10 to be matched, such as circuit substrate, is provided with a mark 18 for positioning X direction and marks 17, 19 for positioning Y direction, moved in X and Y directions and rotated in the theta direction on a matching table. In the matched positions are provided detectors 14', 15', 16' provided with pairs of detector elements AB, CD, A'B' respectively corresponding to marks 18, 17, 19. When said body 10 is positioned, the Y direction movement and theta direction rotation are first repeated to equalize the outputs of the upper and lower detector elements A', B', AB of the detectors 16', 14' and then the X direction movement is carried out to equalize the outputs of the left and right detector elements CD of the detector 15'. Thus, the substrate is matched accurately irrespective of changes in the external light, of reflectance of the mark, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56073765A JPS57189736A (en) | 1981-05-15 | 1981-05-15 | Matching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56073765A JPS57189736A (en) | 1981-05-15 | 1981-05-15 | Matching method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57189736A true JPS57189736A (en) | 1982-11-22 |
Family
ID=13527634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56073765A Pending JPS57189736A (en) | 1981-05-15 | 1981-05-15 | Matching method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57189736A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085863U (en) * | 1983-11-17 | 1985-06-13 | 富士通テン株式会社 | printed wiring board |
JPS60165119U (en) * | 1984-04-12 | 1985-11-01 | トヨタ自動車株式会社 | screw tightening device |
JPS6359400U (en) * | 1986-10-03 | 1988-04-20 | ||
JPS6427822A (en) * | 1987-07-23 | 1989-01-30 | Matsushita Electric Ind Co Ltd | Substrate position correcting method |
-
1981
- 1981-05-15 JP JP56073765A patent/JPS57189736A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085863U (en) * | 1983-11-17 | 1985-06-13 | 富士通テン株式会社 | printed wiring board |
JPS60165119U (en) * | 1984-04-12 | 1985-11-01 | トヨタ自動車株式会社 | screw tightening device |
JPH0144286Y2 (en) * | 1984-04-12 | 1989-12-21 | ||
JPS6359400U (en) * | 1986-10-03 | 1988-04-20 | ||
JPS6427822A (en) * | 1987-07-23 | 1989-01-30 | Matsushita Electric Ind Co Ltd | Substrate position correcting method |
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