JPS5621337A - Manufacture of semiconductor element - Google Patents

Manufacture of semiconductor element

Info

Publication number
JPS5621337A
JPS5621337A JP9765079A JP9765079A JPS5621337A JP S5621337 A JPS5621337 A JP S5621337A JP 9765079 A JP9765079 A JP 9765079A JP 9765079 A JP9765079 A JP 9765079A JP S5621337 A JPS5621337 A JP S5621337A
Authority
JP
Japan
Prior art keywords
substrate
peripheral part
manufacture
chipping
blocked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9765079A
Other languages
Japanese (ja)
Inventor
Hideo Kashimada
Masamichi Yoshida
Kazunori Imaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9765079A priority Critical patent/JPS5621337A/en
Publication of JPS5621337A publication Critical patent/JPS5621337A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent the adverse effect of fine powder and damage which are produced when a semiconductor substrate is handled, by previously making a step or a groove on the peripheral part of the substrate. CONSTITUTION:To manufacture the semiconductor element, the step 4 is provided on the obverse side of the peripheral part of an Si substrare 1. After that, the element is manufactured by a conventional process. Fine powder, which is made as a result of chipping of an edge 5 when the Si substrate 1 is attached to or detached from a manufacturing unit or a jig in the element manufacturing process, is blocked by the wall 6 of the step 4 to greatly reduce flying-away onto the obverse surface 2 of the substrate 1. Defects such as a slip, which is caused by the chipping, are blocked by the wall 6 from extending to the central part of the obverse surface. A groove may be provided on the peripheral part of the substrate 1 instead of the step 4.
JP9765079A 1979-07-31 1979-07-31 Manufacture of semiconductor element Pending JPS5621337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9765079A JPS5621337A (en) 1979-07-31 1979-07-31 Manufacture of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9765079A JPS5621337A (en) 1979-07-31 1979-07-31 Manufacture of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5621337A true JPS5621337A (en) 1981-02-27

Family

ID=14197962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9765079A Pending JPS5621337A (en) 1979-07-31 1979-07-31 Manufacture of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5621337A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120343A (en) * 1981-01-19 1982-07-27 Oki Electric Ind Co Ltd Manufacture of substrate for semiconductor element
JPS5874044A (en) * 1981-10-29 1983-05-04 Matsushita Electric Ind Co Ltd Semiconductor substrate
JP2006310702A (en) * 2005-05-02 2006-11-09 Sharp Corp Substrate supporting method and semiconductor substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120343A (en) * 1981-01-19 1982-07-27 Oki Electric Ind Co Ltd Manufacture of substrate for semiconductor element
JPS5874044A (en) * 1981-10-29 1983-05-04 Matsushita Electric Ind Co Ltd Semiconductor substrate
JP2006310702A (en) * 2005-05-02 2006-11-09 Sharp Corp Substrate supporting method and semiconductor substrate

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