JPH0142356Y2 - - Google Patents

Info

Publication number
JPH0142356Y2
JPH0142356Y2 JP12003283U JP12003283U JPH0142356Y2 JP H0142356 Y2 JPH0142356 Y2 JP H0142356Y2 JP 12003283 U JP12003283 U JP 12003283U JP 12003283 U JP12003283 U JP 12003283U JP H0142356 Y2 JPH0142356 Y2 JP H0142356Y2
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
hybrid integrated
coated
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12003283U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6027441U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12003283U priority Critical patent/JPS6027441U/ja
Publication of JPS6027441U publication Critical patent/JPS6027441U/ja
Application granted granted Critical
Publication of JPH0142356Y2 publication Critical patent/JPH0142356Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP12003283U 1983-08-01 1983-08-01 混成集積回路装置 Granted JPS6027441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12003283U JPS6027441U (ja) 1983-08-01 1983-08-01 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12003283U JPS6027441U (ja) 1983-08-01 1983-08-01 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6027441U JPS6027441U (ja) 1985-02-25
JPH0142356Y2 true JPH0142356Y2 (h) 1989-12-12

Family

ID=30275242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12003283U Granted JPS6027441U (ja) 1983-08-01 1983-08-01 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6027441U (h)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571795Y2 (ja) * 1990-03-08 1998-05-18 株式会社村田製作所 樹脂封止形電子部品
JP2005243746A (ja) * 2004-02-24 2005-09-08 Nippon Chemicon Corp バリスタ
CA2913996C (en) * 2013-05-31 2021-08-31 Cytec Industries Inc. Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Also Published As

Publication number Publication date
JPS6027441U (ja) 1985-02-25

Similar Documents

Publication Publication Date Title
JP3704864B2 (ja) 半導体素子の実装構造
JP2781020B2 (ja) 半導体装置およびその製造方法
JP2001015682A (ja) 樹脂封止型電子装置
JP2977763B2 (ja) 包封されたチップオンボード電子モデュールの製造方法
JPH0142356Y2 (h)
US4639830A (en) Packaged electronic device
EP0260360B1 (en) Resin-sealed semiconductor device
JP2944768B2 (ja) 集積回路部品とその製造方法
JPS622778Y2 (h)
JP2506938Y2 (ja) 樹脂封止型電子回路装置
JPH11284096A (ja) 半導体パッケージ
JPH06334070A (ja) 混成集積回路装置
JPH04252041A (ja) 混成集積回路の製造方法
JP2779843B2 (ja) 電子部品搭載用基板及び電子部品パッケージ
JPH0536299Y2 (h)
JPS63116451A (ja) 混成集積回路装置
JP2001308230A (ja) 半導体装置
JPH07135203A (ja) 半導体装置
JPS6025915Y2 (ja) 電子部品実装構造
JPS6342530Y2 (h)
JPS601847A (ja) 混成集積回路
JPS5979555A (ja) 樹脂封止型半導体装置の製造方法
JP2555519Y2 (ja) 表面実装樹脂封止型半導体装置
JPS62108554A (ja) 混成集積回路装置及びその製造方法
JPS6112700Y2 (h)